1001-3474
2001 Issue 2
..............page:91-92
Al-Si-Cu-RE Die Casting Alloy
feng jun
feng jun
..............page:89-90,a2
Discussion of Adhesive Printing Process
shen xin hai
shen xin hai
..............page:69-70,76
..............page:67-68,73
No-cleaning Reflow Profile and Soldered Defects
zhang cai yun ; li min ; cai ke xin
zhang cai yun ; li min ; cai ke xin
..............page:64-66
Impact of Reflow Parameter on Solder Joint Reliability
zhao jun wei ; nie yan ping ; zhao zhi ping
zhao jun wei ; nie yan ping ; zhao zhi ping
..............page:60-63
The Technology of SMT Solder Joint Quality Automatic Testing and Intelligent Detecting
zhou de jian ; li chun quan ; huang chun yue ; wu zhao hua
zhou de jian ; li chun quan ; huang chun yue ; wu zhao hua
..............page:56-59
Application of Numerical Simulation of Stress-Strain Field Distribution in the Solder Joints
ma zuo ; liu fa ; qian yi yu
ma zuo ; liu fa ; qian yi yu
..............page:51-55
..............page:47-50
..............page:86-88
Talk on Pre-treatment Technological Formula of Aluminium-parts in Electronic Production
wang ai rong ; wei jian zhong
wang ai rong ; wei jian zhong
..............page:84-85
HGL-650 Drying Furnace and Drying Process
lu feng ; di hong peng ; wang ben fang ; wang cai yun
lu feng ; di hong peng ; wang ben fang ; wang cai yun
..............page:81-83
Hot-dip Aluminizing and the Effects of RE Additive
sun ke ning ; tang jing chun ; qi yong qing
sun ke ning ; tang jing chun ; qi yong qing
..............page:79-80,83
Ultrasonic Weve Cleaning Principle and Process Analysis
sun hong ri ; lin guo hui
sun hong ri ; lin guo hui
..............page:77-78
Design of Field Discharge Coil
zhao yang ; li wei feng
zhao yang ; li wei feng
..............page:74-76
Effectiveness of Barrier Metals of the Thin-film Metalized LTCC Substrates for Eutectic Solder Bumps
wu shen li
wu shen li
..............page:71-73