1001-3474
1999 Issue 3
..............page:123-125
The Development of CAD-CAM Data Transfer
Zhang Wenjie
Zhang Wenjie
..............page:126-129
..............page:130
Research on Sulphuret Films of Forming on Copper Surface and the Electrical Contact Propertise
Yang Guang;Zhang Jigao;Bao Chunyan
Yang Guang;Zhang Jigao;Bao Chunyan
..............page:120-122
Computer Simulation Application for EDM Machining
Lou Leming;Xiao Wenfang;Li Minghui;Peng Yinghong
Lou Leming;Xiao Wenfang;Li Minghui;Peng Yinghong
..............page:115-119
..............page:113-114
Study on Art-type Epoxy Polyester Powdered Paint and Its Anticorrosive Performance Test
Che Zhaohua;Wang Ducheng;Li Xiaoming
Che Zhaohua;Wang Ducheng;Li Xiaoming
..............page:109-112
Effect of Annealing on Intermetallic Cu-Sn of 96.5Sn3.5Ag Solder Joint
Tang Qinghua;Pan Xiaoguang;Lawrance C.M.Wu
Tang Qinghua;Pan Xiaoguang;Lawrance C.M.Wu
..............page:106-108
..............page:103-105
SMT Adhesive Properties and Application Method
Tao Jing;Yin Wangen
Tao Jing;Yin Wangen
..............page:100-102
..............page:98-99
Study on Direct Plating of Printed Circuit Board
Yang Weisheng;Mao Xiaoli
Yang Weisheng;Mao Xiaoli
..............page:94-97
The Orthogonal Experiment and Regression Analysis of PBGA Solder Joint Thermal Life
Liu Changkang;Zhou Dejian
Liu Changkang;Zhou Dejian
..............page:90-93
An Experimental Study on the Creep Properties of Sn-Pb-Re Solder Alloy
Wang Li;Zu Lijun;Fang Hongyuan;Qian Yiyu;Ding Kejian
Wang Li;Zu Lijun;Fang Hongyuan;Qian Yiyu;Ding Kejian
..............page:87-89