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Electronics and Packaging
1681-1070
2016 Issue 9
CFD Numerical Simulation of Electronic Equipment Cooling in the Perspective of Field Synergy Principle
MA Fangfang;,YUN Heming;,LI Yongzhen;
..............
page:1-5
SiP-based Integrated Electronic System of Spacecraft
HUANG Hu;,LI Hua;,KONG Yong;,FAN Guochen;,ZHANG Yaolei;
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page:6-9,27
A Test Method of Lithium Battery Charging IC
ZHANG Penghui;
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page:10-13,30
ESD Protection Design for CMOS High Speed I/O
SUN Yunhua;,ZOU Jiaxuan;
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page:14-17
A High Order Temperature Compensation Bandgap Voltage Reference Based on the Feedback Controlling
WANG Yuxing;,WU Jin;
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page:18-23
A Design Method of PCI-bus-based Digital Pattern Generator
LU Jun;,ZHANG Guoliang;,CAO Jing;,CHEN Lun;
..............
page:24-27
Investigation and Design of Millimeter-wave T/R Sub-array
ZHANG Wei;,ZHANG Junhua;
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page:28-30
Layout Design of SKILL-based Parameterized Radiation-hardened Device
HU Yongqiang;,ZHOU Yuan;
..............
page:31-34,39
Study of Halo Technology in Improving Device Performance
XU Zheng;,LI Hongzheng;,ZHAO Wenbin;
..............
page:35-39
Study of Radiation Hardening Technology of Bulk CMOS Integrated Circuits
MI Dan;,ZUO Lingling;
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page:40-43
Feasibility Study on Wafer Dicing by Silicon Deep Reactive Ion Etching
LIU Xueqin;,DONG Anping;
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page:44-47