1681-1070
2016 Issue 3
Packaging Process of SiC Hybrid Power Module
XU Wenhui;,CHEN Yun;,WANG Li;
XU Wenhui;,CHEN Yun;,WANG Li;
..............page:1-3,8
Study on IMC Formation of Different Sn-Pb Bumps with Multiple Reflow Times
WEN Huidong;,LIN Pengrong;,LIAN Binhao;,WANG Yong;,YAO Quanbin;
WEN Huidong;,LIN Pengrong;,LIAN Binhao;,WANG Yong;,YAO Quanbin;
..............page:4-8
Hermetic Soldering Technics on Kovar and Al/SiCp Composite Material
JIN Jiafu;,YANG Cheng;,HUO Shaoxin;
JIN Jiafu;,YANG Cheng;,HUO Shaoxin;
..............page:9-11
The Research of MCM Packaging Technology
HU Yanni;
HU Yanni;
..............page:12-14
The Research of Testing Technology for Flash Memory of NOR Type
WANG Zhengyu;,ZHAO Hua;
WANG Zhengyu;,ZHAO Hua;
..............page:15-19,30
FPGA Configuration SRAM Design Technology
ZHANG Yanfei;,GEN Yang;
ZHANG Yanfei;,GEN Yang;
..............page:20-22
..............page:23-25,47
Design of Radiation Hardened SRAM Based on DICE
SHEN Jing;,XUE Haiwei;
SHEN Jing;,XUE Haiwei;
..............page:26-30
The Design and Implementation of a Multichannel Buffered Serial Port
YANG Xiaogang;,QIANG Xiaoyan;,LIU Taiguang;
YANG Xiaogang;,QIANG Xiaoyan;,LIU Taiguang;
..............page:31-36
..............page:37-40
Failure Analysis of HTCC Integral Substrate/Package
QIU Yingxia;,HU Jun;,LIU Jianjun;
QIU Yingxia;,HU Jun;,LIU Jianjun;
..............page:41-44
A New Type Thermal Method for Oxygen Concentration Measurement
QIAN Jiangrong;,CHEN Cong;,XU Lei;,HU Guojun;
QIAN Jiangrong;,CHEN Cong;,XU Lei;,HU Guojun;
..............page:45-47