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Electronics and Packaging
1681-1070
2016 Issue 12
Research of Statistic Process Control in Gold Wire-bonding
FAN Shaoqun;,ZHAO Dan;
..............page:1-5,11
Studies of Effect of Adhesion Promoter on Epoxy Molding Compound
QIN Wangyang;,ZHANG Gaowen;,DING Quanqing;
..............page:6-11
Research of InSn48 Vacuum Soldering for Optoelectronic Window
WANG Binbin;,JIANG Defeng;
..............page:12-15,19
An Iteration-based Fuse Trimming Test Method
WU Xiwen;,GU Weimin;
..............page:23-25
A Design of ECAN Embedded in DSP2F0X and Communication System
BAO Yipeng;,QIANG Xiaoyan;
..............page:26-29,39
Research on Simulation Method of Large Capacity Synchronous Dual-port SRAM
ZHOU Yunbo;,LI Xiaorong;
..............page:35-39
Studies of Quality Control During Secondary Screening
WANG Yu;
..............page:40-43