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Electronics and Packaging
1681-1070
2016 Issue 12
Research of Statistic Process Control in Gold Wire-bonding
FAN Shaoqun;,ZHAO Dan;
..............
page:1-5,11
Studies of Effect of Adhesion Promoter on Epoxy Molding Compound
QIN Wangyang;,ZHANG Gaowen;,DING Quanqing;
..............
page:6-11
Research of InSn48 Vacuum Soldering for Optoelectronic Window
WANG Binbin;,JIANG Defeng;
..............
page:12-15,19
Research of a Test Technology for Optical Signal Processing Chip
ZHANG Penghui;
..............
page:16-19
Application of Vision Inspection System for Symmetrical Device Misplacement on Packing Tape
TANG Mingching;,ZHANG Jun;
..............
page:20-22,34
An Iteration-based Fuse Trimming Test Method
WU Xiwen;,GU Weimin;
..............
page:23-25
A Design of ECAN Embedded in DSP2F0X and Communication System
BAO Yipeng;,QIANG Xiaoyan;
..............
page:26-29,39
A Design of TCXO Chip with High Accuracy and Wide Compensation Temperature Range
CHEN Futao;
..............
page:30-34
Research on Simulation Method of Large Capacity Synchronous Dual-port SRAM
ZHOU Yunbo;,LI Xiaorong;
..............
page:35-39
Studies of Quality Control During Secondary Screening
WANG Yu;
..............
page:40-43
Design and Application of System of Surface Water Quality Monitoring and Warning based on Internet of Things
ZHANG Jing;,HUANGFU Weizhe;
..............
page:44-47