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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2016 Issue 10
Overview of Development of Interconnected PCB
ZOU Jiajia;,ZHAO Dan;,CHENG Mingsheng;
..............page:1-5
Status-Quo and Challenges of CCGA Solder Columns
LI Shouwei;,MAO Chongchong;,YAN Dandan;
..............page:6-10,18
Optimization of Stainless Screen Cleaning During LTCC Process
LU Huixiang;,CHEN Lei;,TANG Xiaoping;,YAN Yingzhan;
..............page:11-14
Evaluation of IC Test Equipment After Replacement
HE Yanqing;
..............page:15-18
Design of Gearbox Circuits for FPGA System
LUO Yang;,HE Guangxu;,LEI Shulan;
..............page:19-22,26
A Technology of Remote Flash Programming to TMS320F2812 with Watchdog-feeding Function
JIANG Jiongwei;,LEI Zhijun;,YU Peng;
..............page:23-26
A Design of Low-Voltage and Low-Power Consumption Multivibrator
YING Tao;,CHEN Diping;,LI Jingshan;
..............page:27-31
Packing Implementation and Verification for 10M-gate FPGA
HU Kai;,DONG Zhidan;,HUI Feng;,LI Qing;,DONG Yiping;
..............page:32-35,42
Studies of Transient Temperature Response of Power Amplifier ICs in T/R Module
SHENG Zhong;,ZHOU Jun;,DING Xiaoming;,SHEN Ya;
..............page:39-42
Research of Full-power Aging Technology for Microwave Transistor
WANG Xiaoping;,LI Xue;,ZHANG Limin;,QIN Hao;
..............page:43-47