1681-1070
2015 Issue 8
Development of Micropackage Technology for Through Silicon Via (TSV) Interposer
LIU Xiaoyang;,LIU Haiyan;,YU Daquan;,WU Xiaolong;,CHEN Wenlu;
LIU Xiaoyang;,LIU Haiyan;,YU Daquan;,WU Xiaolong;,CHEN Wenlu;
..............page:1-8
Finite Element Analysis of Effects of Cover Plate Structure on Residual Stress of Device in Sealing Test Process
ZHAO Bo;,GUO Huaixin;,CHENG Kai;,WANG Ziliang;
ZHAO Bo;,GUO Huaixin;,CHENG Kai;,WANG Ziliang;
..............page:9-12
To Judge and Analyze nA Level Electric Leakage of Probe Cards
GU Ji;,CHEN Haibo;
GU Ji;,CHEN Haibo;
..............page:13-16,33
CLB Module Testing Technology of SRAM-based FPGA
WANG Jianchao;,LU Feng;,GU Weimin;
WANG Jianchao;,LU Feng;,GU Weimin;
..............page:17-20
Power Nets Design for SoC
ZHANG Ling;,WANG Li;
ZHANG Ling;,WANG Li;
..............page:21-24
Design and Implementation of Slave Mode of USB2.0 Device Interface Chip
JIN Junxiao;,WANG Yajun;,ZHAO Linna;,YU Zhiguo;,WEI Jinghe;,GU Xiaofeng;
JIN Junxiao;,WANG Yajun;,ZHAO Linna;,YU Zhiguo;,WEI Jinghe;,GU Xiaofeng;
..............page:25-28,48
Research on Non-adaptive Routing Algorithm in NoC
LI Tianyang;,PAN Nengzhi;,QV Lingxiang;
LI Tianyang;,PAN Nengzhi;,QV Lingxiang;
..............page:29-33
Research and Design of High Voltage LDMOS with Single Layer Floating Field Plate Structure
WEN Shuai;,QIAO Ming;
WEN Shuai;,QIAO Ming;
..............page:34-37
The Research on Several Manufacturing Methods of PIP Capacitor in CMOS Process
WEN Zhengfeng;,ZHAO Wenkui;,FANG Shaoming;
WEN Zhengfeng;,ZHAO Wenkui;,FANG Shaoming;
..............page:38-43
Based on Ajax Technology of Smart Home Control Page
WANG Tong;,QIN Huibin;,HU Yongcai;
WANG Tong;,QIN Huibin;,HU Yongcai;
..............page:44-48