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Electronics and Packaging
1681-1070
2015 Issue 7
Analysis for the Application of Plastic Encapsulated Micro-circuit in Military Electronic Equipments
LI Run;
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page:1-4
Study on the Reliability of Different Component of BGA Solders Interconnections under the Thermal Fatigue Loading
BAO Cheng;,XU Xing;,CHENG Mingsheng;
..............
page:5-9,13
Research on Conifguration Files of FPGA Based on the ATE
ZHAO Hua;,ZHANG Huibin;
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page:10-13
Design of Class D Power Ampliifer with Output Power Adjustment
ZHI Shengwu;
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page:14-16,27
Monolithic Equalizer Design Using GaAs MMIC Technology
SHEN Yiming;,ZHANG Junzhi;
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page:17-19
Study of the Radiation-hard 0.8 μm SOI CMOS Process Radiation Inlfuence
MA Huihong;,GU Aijun;
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page:20-23
Research of Divided RESURF HVI Structure
ZHANG Xin;,QIAO Ming;
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page:24-27
Design of a Communication Circuit Based on DALI Protocol
WAN Qing;,HU Nanzhong;
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page:28-32,48
Process Optimization to Improve Anti-program Disturb Performance in Split-gate Flash
ZHOU Ruling;,ZHANG Qingyong;
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page:33-36
Processing of the Suspended Micro-structure Based on Bulk Silicon MEMS Technology
LIU Xiaolan;,ZHU Zhengqiang;,DANG Yuanlan;,XU Yaxin;
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page:37-40
Technology Research of T/R Component of L Band Based on FerroA6M
HUANG Xulan;,JIA Shaoxiong;,TIAN Liang;
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page:41-43
High-current Electric Vehicle Battery Charging System’s Current and Voltage Sampling Circuit Design
ZHANG Danyang;,QIN Huibin;
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page:44-48