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Electronics and Packaging
1681-1070
2015 Issue 6
Research Status and Perspective of CoF Package Technology for LCD Drive IC
HU Zhangqi;,WANG Jian;,GUO Han;,CHEN Yu;,CUI Chengqiang;,WANG Fengwei;,CAI Jian;
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page:1-8
Study on Multi-pin Glass-to-metal Seal by Transition Matching
REN Lina;,ZHANG Jianxun;,JU He;
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page:9-12
Vertical Interconnection Techniques Based on LTCC Fuzz-button
SI Jianwen;,XU Li;,WANG Ziliang;
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page:13-15,31
The Principle and Influence Factors of the Thermal Resistance of Power MOSFET Device
KANG Xi’e;
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page:16-18,48
Design of a High Precision Over-temperature Protection Circuit
HUANG Junjun;,QIAO Ming;
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page:19-22
Design and Implementation of USB 2.0 Device Function Verification Platform Based on VMT
JIN Junxiao;,WANG Yajun;,HUANG Pu;,YU Zhiguo;,GU Xiaofeng;,YU Zongguang;
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page:23-27,43
A 5-bit 4 GS/s Interpolation ADC
PENG Yong;,LU Xiang;,TANG He;
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page:28-31
Research on the Mechanical Shear Property of Microbumps with one Sn Grain
WANG Bo;,CHEN Shijie;,ZHU Jinzhuan;,XIA Weisheng;,ZHANG Jiabo;,HE Man;
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page:32-34
The Affection of TID on MTM Anti-fuse Unit
WANG Xu;,ZHENG Ruocheng;,XU Haiming;
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page:35-38,48
The Sensor Monitor Module Design of the Fire Equipment Power Monitoring System
HE Rongrong;,HU Weiwei;,ZHENG Liang;
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page:39-43
Ethernet Multi-test Data Monitoring System Design
CAI Chenxi;,QIN Huibin;
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page:44-48