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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2015 Issue 6
Research Status and Perspective of CoF Package Technology for LCD Drive IC
HU Zhangqi;,WANG Jian;,GUO Han;,CHEN Yu;,CUI Chengqiang;,WANG Fengwei;,CAI Jian;
..............page:1-8
Study on Multi-pin Glass-to-metal Seal by Transition Matching
REN Lina;,ZHANG Jianxun;,JU He;
..............page:9-12
Vertical Interconnection Techniques Based on LTCC Fuzz-button
SI Jianwen;,XU Li;,WANG Ziliang;
..............page:13-15,31
Design of a High Precision Over-temperature Protection Circuit
HUANG Junjun;,QIAO Ming;
..............page:19-22
Design and Implementation of USB 2.0 Device Function Verification Platform Based on VMT
JIN Junxiao;,WANG Yajun;,HUANG Pu;,YU Zhiguo;,GU Xiaofeng;,YU Zongguang;
..............page:23-27,43
A 5-bit 4 GS/s Interpolation ADC
PENG Yong;,LU Xiang;,TANG He;
..............page:28-31
Research on the Mechanical Shear Property of Microbumps with one Sn Grain
WANG Bo;,CHEN Shijie;,ZHU Jinzhuan;,XIA Weisheng;,ZHANG Jiabo;,HE Man;
..............page:32-34
The Affection of TID on MTM Anti-fuse Unit
WANG Xu;,ZHENG Ruocheng;,XU Haiming;
..............page:35-38,48
The Sensor Monitor Module Design of the Fire Equipment Power Monitoring System
HE Rongrong;,HU Weiwei;,ZHENG Liang;
..............page:39-43
Ethernet Multi-test Data Monitoring System Design
CAI Chenxi;,QIN Huibin;
..............page:44-48