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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2015 Issue 5
Research on Structure of Corrugated Diaphragm in Pressure Sensor Packaging
WANG Junjie;,QIN Huibin;
..............page:1-3,20
Test Pattern Analysis of SRAM Dynamic Parameter
ZHANG Ji;,LUO Ximing;,WANG Jun;,TANG Li;,ZHANG Yibo;
..............page:4-6,32
The Design Database Technology of LTCC Microwave Components
XIANG Wei;,LI Jianhui;,LI Tiancheng;
..............page:7-13
Research and Application of the Validation Method of Static Random Access Memory for Space Application
XIAO Aibin;,WANG Feiyao;,WANG Wenyan;,JUAN Yang;,ZHANG Leihao;,ZHANG Haoyuan;
..............page:14-20
A Technology of Flash Programming to TMS320F2812 Based on CAN Interface
JIANG Jiongwei;,QIAN Hao;,YU Peng;
..............page:21-23
Design of Wide Dynamic Variable Gain Ampliifer
GUO Anqiang;,LIU Qianqian;,JIN Yamei;,WANG Zhiwei;
..............page:24-27
2D Simulation of Single Event Burnout in IGBT
WANG Xunyang;,PAN Jianhua;,CHEN Wanjun;
..............page:28-32
Research of Polycrystalline Silicon Resistance Processing Monitor and Inlfuencing Factor
ZHANG Shiquan;,MA Huihong;,WU Xiaodong;
..............page:33-35,40
A Rapid Extraction Method of SOI Device Model Parameters Based on the Total Ionizing Dose Radiation Effect
LI Yanyan;,GU Xiang;,PAN Bin;,ZHU Shaoli;,WU Jianwei;
..............page:36-40
Risk Identiifcation of IC R & D Projects Based on WBS-RBS Matrix
SUN Hua;,HUANG Wei;
..............page:45-48