1681-1070
2015 Issue 4
Parametric Simulation of the Thermal Property of Polymer-based Composite Packaging Materials
WANG Wenzhi;,ZHENG Peng;,ZHOU Jijun;,ZHENG Liang;,QIN Huibin;
WANG Wenzhi;,ZHENG Peng;,ZHOU Jijun;,ZHENG Liang;,QIN Huibin;
..............page:1-4
The Influence of Gold-Tin Eutectic-welding Voids on the Thermal Resistance of Ceramic Package
LI Lianghai;,TONG Liangyu;,GE Qiuling;
LI Lianghai;,TONG Liangyu;,GE Qiuling;
..............page:5-8
..............page:9-13
A Design of Circuit of Generating sin/cos Signals with Double Modes Based on DDS
BAO Shenghui;,QIANG Xiaoyan;,LIU Taiguang;
BAO Shenghui;,QIANG Xiaoyan;,LIU Taiguang;
..............page:14-16,31
..............page:17-19,27
Gate Sizing to Radiation Hardened for Single-event Transients in Digital Logic
TIAN Haiyan;,ZHOU Xiaobin;,CHEN Ju;
TIAN Haiyan;,ZHOU Xiaobin;,CHEN Ju;
..............page:20-22
..............page:23-27
Data Transfers by EDMA in Video Image Processing System
CHEN Zhenjiao;,XU Xinyu;,ZHANG Menghua;
CHEN Zhenjiao;,XU Xinyu;,ZHANG Menghua;
..............page:28-31
The Latest Development and Preparation of Many Elements Codoping YAG Phosphors
YOU Yajun;,GUAN Rongfeng;
YOU Yajun;,GUAN Rongfeng;
..............page:32-35,40
Effects of ZnO on Properties of BaSm2Ti4O12Ceramics
YU Xuan;,XIE Guangchao;,QIN Wangyang;,JIA Lufang;,CHEN Bo;
YU Xuan;,XIE Guangchao;,QIN Wangyang;,JIA Lufang;,CHEN Bo;
..............page:36-40
The Effect of Total Dose Radiation in 0.5 μm PD SOI CMOS Device
XIE Rubin;,WU Jianwei;,HONG Genshen;,LUO Jing;,CHEN Haibo;
XIE Rubin;,WU Jianwei;,HONG Genshen;,LUO Jing;,CHEN Haibo;
..............page:41-45
Indigenous Application of Ammonia Solution and Hydrogen Peroxide
MA Huihong;,WU Xiaodong;,GU Aijun;
MA Huihong;,WU Xiaodong;,GU Aijun;
..............page:46-48