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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2015 Issue 2
Parallel Seam Welding for Glass Insulator Metal Pipe Shell Crack Impact Study
XUE Jingjing;,LI Shousheng;,HOU Yuzeng;
..............page:1-4
Effect of Electrical Erosstalk Frequency in Parameter Control Monitor
LI Xinghe;,JIANG Dawei;,CHEN Peicang;
..............page:12-15,18
Dynamic Parameter Test of High-speed DAC Embedded in DDS
ZHANG Kaihong;,CHEN Zhen;,WANG Jianchao;
..............page:16-18
A Test Pattern Based on Sample Rate of Serial Communication Interface
ZHANG Ji;,YANG Mengxi;,XIE Da;
..............page:19-21,39
A Bandgap Voltage Reference with No Op-amp and Low Power
ZOU Qinli;,TANG Ye;
..............page:22-24,32
Design of a High-performance Clock Buffer
OUYANG Xue;
..............page:25-28,48
Design of a USB Power Switch on Over Current Operation
GUAN Yuanqian;,GUAN Hongyun;
..............page:29-32
New High-distinguish CMOS Current Comparator
CHENG Liang;
..............page:33-35
The Research on Several Manufacturing Methods of SRC Area of Planar VDMOS
MA Wanli;,WEN Zhengfeng;
..............page:36-39
Effects of ZnO and V2O5 Co-doping on Properties of (Zr0.8Sn0.2)TiO4 Ceramics
YU Xuan;,QIN Wangyang;,JIA Lufang;,QIAN Ying;,DING Dong;
..............page:40-43,48