Home
|
Survey
|
Payment
|
Talks & Presentations
|
Job Opportunities
Journals
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
Electronics and Packaging
1681-1070
2015 Issue 11
Research of the Proficiency Testing for the Bond Strength Test
YANG Cheng;,WANG Bochun;,TAN Chen;,ZHANG Ji;,MA Qingtao;,PAN Lingyu;
..............
page:1-4
Effect and Analysis of Defects on the Mechanical Reliability of Ceramic Packaging
ZHANG Jinli;
..............
page:5-9,13
A Way of Testing PAE of Pulse Power Amplifier Based on PNA-X
CHEN Jinyuan;,LI Zhiqun;,QIAN Feng;,JIAO Fang;
..............
page:10-13
Based on the Motor Driver Chip Scan Test Implementation
CHEN Zhen;,ZHANG Kaihong;,WANG Jianchao;
..............
page:14-16,47
The Research of FPGA Routing Resources Testing Technology Based on VIRTEX Architecture
WANG Jianchao;,LU Feng;,ZHANG Kaihong;
..............
page:17-20
Design of a High Performance Error Amplifier for Switching Power Supply
PAN Fuyue;,LI Xiankun;
..............
page:21-25,38
A High-Performance CMOS Bandgap Voltage Reference
YANG Xiaolei;,ZHANG Qinfeng;,JIANG Yingdan;
..............
page:26-29
The Design of a Frequency-tuning Circuit with Temperature Compensation Used in C-Band Radio Altimeter
XIA Mou;,XIA Yongping;,WEI Bin;,YANG Bin;
..............
page:30-33
geng zheng
dian zi yu feng zhuang bian ji bu ;
..............
page:33-33
Research Multi-CORE Base on Network on System Technology
ZHAO Baogong;,XU Yujie;,QU Lingxiang;
..............
page:34-38
One Solution to Improve Peripheral Gate Oxide Degradation in Flash by Tunnel Oxide Nitridation Engineering
LI Shaobin;
..............
page:39-42
A Design Method of Device Parameters of SRAM
XU Zheng;,LI Hongzheng;,ZHAO Wenbin;
..............
page:43-47
dian zi yu feng zhuang za zhi zheng gao qi shi
..............
page:48-48