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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2015 Issue 11
Research of the Proficiency Testing for the Bond Strength Test
YANG Cheng;,WANG Bochun;,TAN Chen;,ZHANG Ji;,MA Qingtao;,PAN Lingyu;
..............page:1-4
A Way of Testing PAE of Pulse Power Amplifier Based on PNA-X
CHEN Jinyuan;,LI Zhiqun;,QIAN Feng;,JIAO Fang;
..............page:10-13
Based on the Motor Driver Chip Scan Test Implementation
CHEN Zhen;,ZHANG Kaihong;,WANG Jianchao;
..............page:14-16,47
The Research of FPGA Routing Resources Testing Technology Based on VIRTEX Architecture
WANG Jianchao;,LU Feng;,ZHANG Kaihong;
..............page:17-20
Design of a High Performance Error Amplifier for Switching Power Supply
PAN Fuyue;,LI Xiankun;
..............page:21-25,38
A High-Performance CMOS Bandgap Voltage Reference
YANG Xiaolei;,ZHANG Qinfeng;,JIANG Yingdan;
..............page:26-29
The Design of a Frequency-tuning Circuit with Temperature Compensation Used in C-Band Radio Altimeter
XIA Mou;,XIA Yongping;,WEI Bin;,YANG Bin;
..............page:30-33
geng zheng
dian zi yu feng zhuang bian ji bu ;
..............page:33-33
Research Multi-CORE Base on Network on System Technology
ZHAO Baogong;,XU Yujie;,QU Lingxiang;
..............page:34-38
A Design Method of Device Parameters of SRAM
XU Zheng;,LI Hongzheng;,ZHAO Wenbin;
..............page:43-47