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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2015 Issue 10
Thermal Simulation of FC-PBGA644 Package
SHI Lei;,HUANG Jinxin;,MIAO Xiaoyong;,WANG Honghui;
..............page:1-3
Case Studies on Delamination of Plastic Packaging Device
WU Xiaoliang;,ZHOU Xuewei;,FANG Yuan;
..............page:4-7,19
A Design of RF Transceiver Front-end Signal Processing System Base on FPGA
GOU Huanmin;,ZHI Min;
..............page:12-15,43
FPGA-based Imitate RF in the Application of ASIC Prototyping System
SHANG Yang;,WANG Qianzhu;
..............page:16-19
Design and Verification of MAC Layer Based on PCIe Bus
WANG Li;,WANG Lei;,ZHANG Ling;
..............page:20-25
Improved Design of Radiation-Hardened Flip Flop in 0.13 μm Technology
LI Xiaorong;,ZHOU Xinjie;
..............page:26-29
The Past, Present and Future of Moore's Law
DAI Jinwen;,MIAO Xiaoyong;
..............page:30-34
The Realization of a Positioning and Tracking System Based on BD2 Satellite
XIA Yongping;,XIA Mou;,HAN Liujun;
..............page:35-38
Design of a Data Sinking and Storingnode for Wireless Sensor Networks Based on USB
WANG Yajun;,YU Zhiguo;,GU Xiaofeng;
..............page:39-43
Grain Insect Monitor Based on Image Sensors and Wireless Sensor Networks
YANG Peikai;,SHI Xiong;,LI Lin;
..............page:44-48