1681-1070
2015 Issue 1
..............page:1-5
..............page:6-9,27
Research of TLP Test Method for Wafer
ZOU Qiaoyun;,JIANG Rudong;
ZOU Qiaoyun;,JIANG Rudong;
..............page:10-13
Large Inductance Value PCB Planar Inductor Design Using Magnetic Substrate
MENG Zhen;,LIU Yanchun;,ZHAO Wenying;,HUANG Mian;,YAN Yuepeng;
MENG Zhen;,LIU Yanchun;,ZHAO Wenying;,HUANG Mian;,YAN Yuepeng;
..............page:14-18,23
Design and Implementation of 3DES Algorithm IP-core Based on AMBA Bus
WANG Li;,ZHANG Ling;,QU Lingxiang;
WANG Li;,ZHANG Ling;,QU Lingxiang;
..............page:19-23
A Low-Power Dissipation BGR without Resistor and Operational Amplifier Based on 0.18 μm Process
LI Yanxia;,GONG Min;,GAO Bo;
LI Yanxia;,GONG Min;,GAO Bo;
..............page:24-27
Ethernet Test and Verification System Based on 82551
ZHANG Rong;,XU Xiaobin;,LUO Sheng;,ZHANG Guoxian;,PANG Lipeng;
ZHANG Rong;,XU Xiaobin;,LUO Sheng;,ZHANG Guoxian;,PANG Lipeng;
..............page:28-30,48
An Efficient Design Methodology for Gearbox Circuits in 10 Gbps Ethernet Transceiver
HUANG Anjun;,LUO Yang;,LEI Shulan;
HUANG Anjun;,LUO Yang;,LEI Shulan;
..............page:31-35
500 V LDMOS Development
CUI Jinhong;,SHI Jincheng;
CUI Jinhong;,SHI Jincheng;
..............page:36-40
Research Progress and Development Trends of Glass Used in Electronic Paste
YU Shouyu;,FU Renli;,ZHANG Jie;
YU Shouyu;,FU Renli;,ZHANG Jie;
..............page:41-48