1681-1070
2014 Issue 9
Analysis of the Performance of Bonding Wire Transmission Structure in IC Package
SUN Haiyan;,SUN Ling;,YANG Lingling;
SUN Haiyan;,SUN Ling;,YANG Lingling;
..............page:1-4,24
The Study of Reforming Pins for Surface Mount Integrated Circuit
DENG Yong;,YANG Cheng;
DENG Yong;,YANG Cheng;
..............page:5-8,32
..............page:9-12,16
Parallel Test Method on Two IC Handler
ZHOU Chun;
ZHOU Chun;
..............page:13-16
A Skillful Technology for Low MOSFET RDS(on) Testing
GU Hanyu;,WU Qianwen;
GU Hanyu;,WU Qianwen;
..............page:17-20
Design of Self-relfesh Flip-lfop Based on Triple Module Redundancy
CHEN Zhongpeng;,SHI Binyou;,WAN Shuqin;,ZOU Qiaoyun;
CHEN Zhongpeng;,SHI Binyou;,WAN Shuqin;,ZOU Qiaoyun;
..............page:21-24
Double Balanced Mixer Design and Research
CHI Kai;,LIU Fei;
CHI Kai;,LIU Fei;
..............page:25-27,47
Design of RF Lumped High-pass Filter with Multiple Transmission Zeros
LIU Jianxi;,LUO Bing;,WANG Xirui;,ZHANG Yongliang;,ZHONG Junliu;
LIU Jianxi;,LUO Bing;,WANG Xirui;,ZHANG Yongliang;,ZHONG Junliu;
..............page:28-32
Research of Negative Group Delay Circuit Based on Multistage Asymmetrical Directional Coupler
DAI Yongsheng;,DENG Liang;
DAI Yongsheng;,DENG Liang;
..............page:33-35
Design of a Low Supply Piecewise Curvature Corrected CMOS Bandgap Reference
CHEN Tao;,HU Lizhi;,QIAO Ming;
CHEN Tao;,HU Lizhi;,QIAO Ming;
..............page:36-39
The Application and the Research on the Process of Amorphous Carbon Dry Etch in MEMS/Sensor
FU Guangcai;,NI Liang;,WANG Xinxue;
FU Guangcai;,NI Liang;,WANG Xinxue;
..............page:40-43
Application of Wireless Charging Technology in Sensor Networks for Grain Pest Detection
XU Lianxiang;,YANG Weifeng;
XU Lianxiang;,YANG Weifeng;
..............page:44-47
..............page:48-48