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Electronics and Packaging
1681-1070
2014 Issue 4
The Calculation Method of Thermal Resistance about QFN72 and CQFN72
CAI Jian;,DING Rongzheng;,JIA Songliang;,WANG Qian;
..............
page:1-4
The Fabrication of AlN-Al Substrate
LI Minghe;,PENG Lei;,WANG Wenfeng;
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page:5-8
A Study on the Promoting Methods of CBGA Bumping Process Maturity
HUANG Yingzhuo;,LIAN Binhao;,LIN Pengrong;,TIAN Lingjuan;
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page:9-13
Research on Testing Method of Single-supply/Dual-supply Integrated Operational Amplifier Based on the JC-5600 ATE
ZHANG Huibin;,ZHAO Hua;
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page:14-16
A SRAM Cell and Control Circuits Design for FPGA
LIN Douxun;,XU Xinyu;,XU Yuting;
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page:17-19,48
The Design of a New Reference Current Source
CHEN Zhongpeng;,HUANG Zhaojun;,SHI Binyou;,WAN Shuqin;,ZHANG Tao;,ZHU Qi;
..............
page:20-23
A Low-jitter Charge-pump Phase-locked Loop Synthesizer
HUANG Zhaojun;,JI Huicai;,SHI Binyou;,YANG Xiaolei;
..............
page:24-27,44
Design and Implementation of a Platform for FPGA Development Based on the Virtualization
WAN Qin;,ZHANG Haiping;
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page:28-30,37
Study on Plasma Cleaning Process of Aluminium Wire Bonding
ZHONG Xiaogang;
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page:31-33,41
The Research of Latch-up Preventing in CMOS Technology
HUA Mengqi;,ZHU Qi;
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page:34-37
EPI Deposition Parameter Stability Control Method
GAO Xiang;,WANG Haihong;
..............
page:38-41
Circuit-level Lifetime Simulation Based on HCI
CAO Yanjie;,CHEN Ju;,GAO Guoping;,ZHOU Xiaobin;
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page:42-44
The Study of High-density SIP Design’s Reliability
CHEN Zifeng;,WANG Liangjiang;,YANG Fang;
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page:45-48