Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2014 Issue 4
The Calculation Method of Thermal Resistance about QFN72 and CQFN72
CAI Jian;,DING Rongzheng;,JIA Songliang;,WANG Qian;
..............page:1-4
The Fabrication of AlN-Al Substrate
LI Minghe;,PENG Lei;,WANG Wenfeng;
..............page:5-8
A Study on the Promoting Methods of CBGA Bumping Process Maturity
HUANG Yingzhuo;,LIAN Binhao;,LIN Pengrong;,TIAN Lingjuan;
..............page:9-13
A SRAM Cell and Control Circuits Design for FPGA
LIN Douxun;,XU Xinyu;,XU Yuting;
..............page:17-19,48
The Design of a New Reference Current Source
CHEN Zhongpeng;,HUANG Zhaojun;,SHI Binyou;,WAN Shuqin;,ZHANG Tao;,ZHU Qi;
..............page:20-23
A Low-jitter Charge-pump Phase-locked Loop Synthesizer
HUANG Zhaojun;,JI Huicai;,SHI Binyou;,YANG Xiaolei;
..............page:24-27,44
Study on Plasma Cleaning Process of Aluminium Wire Bonding
ZHONG Xiaogang;
..............page:31-33,41
The Research of Latch-up Preventing in CMOS Technology
HUA Mengqi;,ZHU Qi;
..............page:34-37
EPI Deposition Parameter Stability Control Method
GAO Xiang;,WANG Haihong;
..............page:38-41
Circuit-level Lifetime Simulation Based on HCI
CAO Yanjie;,CHEN Ju;,GAO Guoping;,ZHOU Xiaobin;
..............page:42-44
The Study of High-density SIP Design’s Reliability
CHEN Zifeng;,WANG Liangjiang;,YANG Fang;
..............page:45-48