1681-1070
2014 Issue 3
Study on Mechanism and Experiment of the Capture and Deformation of Conductive Particles During ACF Bonding Process
HUANG Yang;,TAO Bo;,WU Guanghua;,XU Renxiao;,ZHU Qinmiao;
HUANG Yang;,TAO Bo;,WU Guanghua;,XU Renxiao;,ZHU Qinmiao;
..............page:1-4
Simulation of Constant Acceleration Experiment and Analyze of Failure in Ceramic Package Device
DING Rongzheng;,SUN Shaopeng;,YANG Yibo;,ZHANG Shunliang;
DING Rongzheng;,SUN Shaopeng;,YANG Yibo;,ZHANG Shunliang;
..............page:5-8
Introduction of a Corrosion-resistant High-reliability Silver Alloy Bonding Wire in Package
LIN Liang;,ZANG Xiaodan;
LIN Liang;,ZANG Xiaodan;
..............page:9-13
Research and Development of Packaging for the Tandem Type Diode
FANG Yiyu;,YAN Shenghu;
FANG Yiyu;,YAN Shenghu;
..............page:14-17
A Method Write Built in Test Vector for FPGA Using Perl
CHEN Cheng;,MENG Xiangyuan;,ZHANG Xiujun;
CHEN Cheng;,MENG Xiangyuan;,ZHANG Xiujun;
..............page:18-20,28
Some Effective Method of Reducing the Clock Delay in Back-end Realization
GU Guanghua;,HE Zhiwei;,ZHANG Haiping;
GU Guanghua;,HE Zhiwei;,ZHANG Haiping;
..............page:21-24
Design of Differential and Power Division Network Based on PCB
PENG Yan;,WANG Shengyuan;,XU Libing;
PENG Yan;,WANG Shengyuan;,XU Libing;
..............page:25-28
Analyze and Design of ESD Protection Network for Integrated Circuit on SOI Process
HU Yongqiang;,ZHOU Xiaobin;
HU Yongqiang;,ZHOU Xiaobin;
..............page:29-32,40
An Accumulated Trench-gate Super Barrier Diode
QIAO Ming;,XU Wan;,ZHANG Wentong;,ZHANG Xin;
QIAO Ming;,XU Wan;,ZHANG Wentong;,ZHANG Xin;
..............page:33-36
..............page:37-40
Design of I/O Circuit Reliability in IC
CHEN Chao;,CHEN Yuanjin;,LIU Bin;,LIU Xia;,LV Jiangping;
CHEN Chao;,CHEN Yuanjin;,LIU Bin;,LIU Xia;,LV Jiangping;
..............page:41-45
EDA Software Integration and Remote Access
WAN Qing;,ZHANG Haiping;
WAN Qing;,ZHANG Haiping;
..............page:46-48