1681-1070
2014 Issue 11
Application Research of Cooling Technique on High Density Assembly Electronic Equipment
DI Lanping;,TIAN Feng;,ZHANG Fenghua;,ZHANG Ya’ni;
DI Lanping;,TIAN Feng;,ZHANG Fenghua;,ZHANG Ya’ni;
..............page:1-4,20
Design and Simulation of Board Level Reliability for CQFP Device in Thermal Cycling
JIANG Changshun;,LI Yao;,LI Zongya;,TONG Liangyu;
JIANG Changshun;,LI Yao;,LI Zongya;,TONG Liangyu;
..............page:5-8
A Research of Inspect Technology for High Aspect Rate TSVs
CHEN Bo;,CHEN Guifang;,JI Yong;,MING Xuefei;,YAN Yingqiang;
CHEN Bo;,CHEN Guifang;,JI Yong;,MING Xuefei;,YAN Yingqiang;
..............page:9-12
A High Efifciency Multi-Sites Testing Technology for MCU Chip
CHEN Zhen;,LU Feng;,ZHANG Kaihong;
CHEN Zhen;,LU Feng;,ZHANG Kaihong;
..............page:13-15
A Skillful Technology for Low MOSFETRDS(ON) Testing
FU Jun’ai;,GU Weimin;
FU Jun’ai;,GU Weimin;
..............page:16-20
A Design of 6U Signal Processing System Base on VPX
GOU Huanmin;,XUE Pei;,YANG Fang;
GOU Huanmin;,XUE Pei;,YANG Fang;
..............page:21-25
Rapid IO Interconnected Technology Based on TSI578
JI Xiaoming;,WANG Xianyue;,XIAN Youlun;
JI Xiaoming;,WANG Xianyue;,XIAN Youlun;
..............page:26-30
Design of a High PSRR Bandgap Voltage Reference
HE Ying;,TU Limin;,YI Feng;
HE Ying;,TU Limin;,YI Feng;
..............page:31-33
The Development of CMOS Technology in NPN Bipolar
CUI Jinhong;
CUI Jinhong;
..............page:34-36
The Research of the Process on the Silicon Epitaxial Wafers Used for the Fast Recovery Epitaxial Diodes
CHEN Tao;,LI Mingda;,LI Yang;,WANG Wenlin;
CHEN Tao;,LI Mingda;,LI Yang;,WANG Wenlin;
..............page:37-40
The Application of Scanning Acoustic Microscope Inspect in Flip-chip Device Test
MA Qingtao;,PAN Lingyu;,WANG Bochun;,YANG Cheng;,ZHANG Ji;
MA Qingtao;,PAN Lingyu;,WANG Bochun;,YANG Cheng;,ZHANG Ji;
..............page:41-44
Effect of Removing Electron-blocking Layer on Performance of Dual-blue Wavelength Light-emitting Diodes
TIAN Shifeng;,YAN Qirong;,ZHANG Yong;
TIAN Shifeng;,YAN Qirong;,ZHANG Yong;
..............page:45-48