1681-1070
2013 Issue 9
A Wafer Level Reliability Evaluation Method Based on 0.5μm CMOS Process
TU Qizhi;MA Minhui;ZHAO Wenqing
TU Qizhi;MA Minhui;ZHAO Wenqing
..............page:35-39
Assessment of IC Reliability in Long Storage Life Test
GUAN Guangbao;YIN Ying;ZHANG Huibin
GUAN Guangbao;YIN Ying;ZHANG Huibin
..............page:40-43
Analysis of Noise in Electrical Design of High-density Ceramic Package
YANG Yibo;DING Rongzheng;GAO Nayan;LI Xinyan
YANG Yibo;DING Rongzheng;GAO Nayan;LI Xinyan
..............page:1-5
Dielectric Property of ALD Al2O3 Film and its Application in Silicon Capacitor
CHEN Jie;LI Jun;ZHAO Jinru;LI Xinghe;XU Shenggen
CHEN Jie;LI Jun;ZHAO Jinru;LI Xinghe;XU Shenggen
..............page:31-34
The Study of Low Power Test Platform for Zigbee Chip
LI Hui;XU Ziming;LIAO Juhua
LI Hui;XU Ziming;LIAO Juhua
..............page:44-48
Thermal Simulation and Optimization Analysis for BGA
MA Xiaobo;CHEN Shiguang;WANG Xiyou;WEN Lijun
MA Xiaobo;CHEN Shiguang;WANG Xiyou;WEN Lijun
..............page:10-13
Study of the Effect of Loop Proifle Parameter on Aluminum Wedge Bonding Strength
LIAO Xiaoping;YANG Bing
LIAO Xiaoping;YANG Bing
..............page:14-17
A Design of 32-Bit Fixed-Point DSP Circuit
XUE Haiwei;ZHANG Qingwen;WANG Yueling;XU Xinyu
XUE Haiwei;ZHANG Qingwen;WANG Yueling;XU Xinyu
..............page:22-25,30
Package Structure Design of Flip Chip Device
AO Guojun;ZHANG Guohua;JIANG Changshun;ZHANG Jiaxin
AO Guojun;ZHANG Guohua;JIANG Changshun;ZHANG Jiaxin
..............page:6-9,17
Application of Insulated Bonding Wire in the Ceramic Package
YANG Bing;ZHANG Guohua;LI Zongya
YANG Bing;ZHANG Guohua;LI Zongya
..............page:18-21
Research on Design of Radiation Hardened Layout for Integrated Circuit in Si Technology
TIAN Haiyan;HU Yongqiang
TIAN Haiyan;HU Yongqiang
..............page:26-30