Electronics and Packaging 2013 Issue 7 Solution to Wafer Edge Silicon Grass Defect of Deep Trench Process

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Electronics and Packaging
1681-1070
2013 Issue 7

Solution to Wafer Edge Silicon Grass Defect of Deep Trench Process
QIU Zhichun

..............page:35-37

The Circuit Design of Piezoelectric Jetting Dispensing Control System
CHEN Dan’er;WANG Xiaoping;WANG Shen;LIANG Chuwei;LI Yipan;ZHOU Ruhai;CAI Jianfa;WANG Lingyun

..............page:20-24

Research of Hyper Branched Polyphenyl Silicone Resin Modified Epoxy for Electronic Packaging
LI Lianghai;GE Qiuling;LI Zongya

..............page:1-4,11

Research on Integrated Zener Diode Device Structure and Process
PAN Guangran;WANG Kun

..............page:28-31

Influence Factor of Dielectric Properties of LTCC Materials
CHENG Shubo

..............page:5-7,16

Study of the Scrap Rate Decreace During Silicon Wafer Grinding
CHI Huixiong

..............page:32-34,42

Design and Implementation of Portable GPS Track Logger Scheme
LIU Hao;ZHANG Yongrong

..............page:43-48

ESD Protect in Process of Ceramic Package Assembly
YAN Yan;WANG Yang

..............page:8-11

The Design of Remote Terminal of Wireless Street-Lighting Monitor System
CHEN Qiang;NAN Zhouyu

..............page:38-42

Theory and Solution for Lithography Process Metal Layer Scribe Line Ghost Image
ZHOU Minqi

..............page:25-27

Instrument Automation Test Platform
SU Yang;HUANG Bo;DU Yuanxun;WU Xinzheng

..............page:17-19

Research on Development and Packaging of High-frequency Optical Modulator
WANG Bing;HUANG Ping;YANG Lei

..............page:12-16