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Electronics and Packaging
1681-1070
2013 Issue 6
Design and Characterizing a 65 nm Radiation Hardening Standard Cell Library
CHEN Gang;GAO Bo;GONG Min
..............page:13-17
Developing for Testing Program of Digital Circuits
LIU Shanshan;KANG Xi’e
..............page:10-12,28
Optimization of Scribe Lane Photo Alignment Mark for Semiconductor Manufacturing
LIU Lili;WANG Yonggang;HU Huijuan
..............page:18-20,42
The Research of EMC’s Design for PCB
PENG Liang;HUANG Zhengrong;HUANG Minghui;DU Ying
..............page:24-28
The Optimization and Study of Morphology on Stepped Substrate
HE Qi;ZHANG Shiquan;LIU Guozhu
..............page:21-23
A RS-485 Bus Processor’s Failure Analysis Research
DING Taojie;GUO Hui;LUO Sheng
..............page:29-32
Source Spatter Control in the Process of Electron Beam Evaporation
LI Yunhai;ZHANG Yiping;ZHANG Wen
..............page:7-9,32
The Soldering-Ball Process Technology of BGA
LI Bingwang;WU Hui;XIANG Yuan;XIE Bin
..............page:1-6,37
High Voltage Thin Layer SOI LDMOS for 200 V Level Shift Circuit
CHEN Zhengcai;ZHOU Miao;HONG Genshen;GAO Xiangdong;SU Yuqiu;HE Yitao;QIAO Ming;XIAO Zhiqiang
..............page:38-42