Home
|
Survey
|
Payment
|
Talks & Presentations
|
Job Opportunities
Journals
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
Electronics and Packaging
1681-1070
2013 Issue 5
The Solution to the Bubble Defect Problem in 0.13μm Copper Interconnection Process
zhang lei ; zhu yi ming
..............
page:34-41
FPGA Testing Method Based on the Test System
jie wei kun ; wan qing ; zhang hui bin
..............
page:6-8
MA Minhui, HE Qi Performance Optimization of Blue Organic Light-Emitting Device Based on NPB
ma min hui ; he zuo
..............
page:42-45
Design of C Band LTCC Broadside-coupled Multilayer Filter
cheng shu bo ; zhao zu jun
..............
page:21-23
Experiment Investigation of Epoxy Resin Molding and Coefficient of Thermal Expansion for Electronic Packaging
yang fei ; zhou li
..............
page:1-5
Design of a RF-VCO for Low-Phase-Noise PLL
zhang tao ; jiang zuo dan ; wang li xiu
..............
page:17-20
Empirical Mode Decomposition Method Based on Joint Time-Frequency Distribution
jin jing jing ; geng yuan zuo
..............
page:24-26
The Design of High Precision Conversion Sequence Generation in ADC
wan qing ; xu xin yu ; xue hai wei ; wang zuo
..............
page:12-16
Track Effects Study in the 65 nm n-MOSFET Irradiated by Heavy Ions
gao zuo zuo ; wang ling ; su kai ; ma yao ; yuan zuo ; gong min
..............
page:27-30
Study of Cyanide-free Electroless Gold Plating for Patterned Circuits with Fine-pitch
liu dong guang ; hu jiang hua
..............
page:31-33
One Novel High Power LED Lamp Driver Circuit
zhang bo ; wang heng zhi
..............
page:46-48
The Testing of MC34063 DC/DC Convert Circuit
sun zuo dong ; xing zhuang
..............
page:9-11