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Electronics and Packaging
1681-1070
2013 Issue 2
Self Biased Phase Locked Loop
cao yu ou ; li zhang quan
..............page:14-16
Design of SiP Based Accelerometer with Active Magnetic-suspension Control Circuit
zhang zhi yang ; mao han song
..............page:17-21
Two Quadrant DC/DC ZVS Quasi-Resonant Lou-Converter
wu jian zhong ; zhang chuang ; liu ying ying
..............page:22-27
Use Low Temperature Purge to Reduce Particles of LPCVD Si3N4 Process
luo jun tao ; cheng xiu lan
..............page:32-36
Study of PIN Structure Silicon Photo-detector for IR Control
zhang ming ; fei song qiu
..............page:37-40
Introduction of HDI PCB Delamination Defects Analysis Method
wu jun qiu ; rong guo guang
..............page:41-44
The Pin or Lead of Glass Seal Metal Package
yan zhi liang
..............page:1-3
A Review on Wire Bonding Process in Electronic Manufacturing
zong fei ; wang zhi jie ; xu yan bo ; ye de hong ; shu ai peng ; chen quan
..............page:4-10
Testing Method of LCD Control&Driving Circuit Based on Digital Testing System
wang zheng yu ; zhang shao yun
..............page:11-13