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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2013 Issue 12
Highly Reliable Design of High-density CQFN
DING Rongzheng;,MA Guorong;,SHI Liying;,SONG Xufeng;
..............page:1-5
Application Discussion of EMC in LED Packaging
WANG Yangxia;
..............page:9-11,34
Research on the Application Development of 1553B Bus
CAI Jieming;,HUANG Zheng;,JUAN Yang;,LIU Shiquan;,WEI Jinghe;
..............page:12-15
A Method of Pole Regulation for LDO System
LIAO Ping;,LU Libin;
..............page:16-19,29
Effect of High-pressure Steam on Electric Parameters of Plastic Encapsulated Bipolar Devices
HAN Zhaofang;,HUANG Zhengrong;,LIANG Qi;
..............page:20-22,38
Research on Coplanar Waveguide True-time Delay Line Thin Film Hybrid Circuit
DU Lijun;,LIU Longhua;,QIU Yingxia;,XIE Qilin;
..............page:26-29
Study on Reliability Screening Technology and Failure Mechanism of SOI Circuits
GU Xiaofeng;,HUANG Long;,LIU Di;,LU Jian;
..............page:30-34
IPTV System Based on Cloud Computing
XU Tingya;
..............page:39-42,48