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Electronics and Packaging
1681-1070
2013 Issue 12
Highly Reliable Design of High-density CQFN
DING Rongzheng;,MA Guorong;,SHI Liying;,SONG Xufeng;
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page:1-5
Bond Height Measure and Control of Wire Bonding On Gold-plated Brass
HU Jun;,JIN Jiafu;
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page:6-8
Application Discussion of EMC in LED Packaging
WANG Yangxia;
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page:9-11,34
Research on the Application Development of 1553B Bus
CAI Jieming;,HUANG Zheng;,JUAN Yang;,LIU Shiquan;,WEI Jinghe;
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page:12-15
A Method of Pole Regulation for LDO System
LIAO Ping;,LU Libin;
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page:16-19,29
Effect of High-pressure Steam on Electric Parameters of Plastic Encapsulated Bipolar Devices
HAN Zhaofang;,HUANG Zhengrong;,LIANG Qi;
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page:20-22,38
Study the Failure Mode of Waveguide Detector Device and Improvements
KONG Zhanxing;
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page:23-25,29
Research on Coplanar Waveguide True-time Delay Line Thin Film Hybrid Circuit
DU Lijun;,LIU Longhua;,QIU Yingxia;,XIE Qilin;
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page:26-29
Study on Reliability Screening Technology and Failure Mechanism of SOI Circuits
GU Xiaofeng;,HUANG Long;,LIU Di;,LU Jian;
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page:30-34
A New MOSFET Structure with Self-Aligned Polysilicon Source and Drain Electrodes on a 0.13μm Logic Platform
FAN Jianguo;,HUANG Chen;,LI You;,LV Juilin;
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page:35-38
IPTV System Based on Cloud Computing
XU Tingya;
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page:39-42,48
Application of Multiagent System Based Fault Diagnosis in Smart Grid
LIU Jingjin;
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page:43-48