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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2013 Issue 11
Study of Assembly Technology for TO-220FS
FANG Yiyu;GUAN Beilin
..............page:5-7
Research on Inlfuencing Factors of the Yield and Efifciency of MMCMs’ Automatic Mounting
FAN Shaoqun;HU Jun;QIU Yingxia;SONG Xia
..............page:8-12
Design and Implement of 4-Channels Interleaved Boost DC/DC Converter
LI Jiangda;He Ying;YANG Bing;XIE Wenqun;YANG Fang
..............page:13-16
Based on the UC3842 30 W Boost Circuit Design
ZHENG Ailian;CHEN Ping
..............page:17-19,23
ECC Execution of SSD Base on FPGA
ZHANG Yujie;SHEN Xiaobo
..............page:20-23
A High-efifciency Switch-Mode Power Supply Design for Multi-channel Output
LI Wenhao;DU Peide;YIN Hua
..............page:24-27,43
A Ku Wave Band TR Module Design Based on the Multilayer Arrangement of Wire in PCB
HU Shiwei;FANG Yuan;QIAN Zhiyu
..............page:28-32
Study of Metal-to-Metal Antifuse Characteristics for Field Programmable Gate Array Devices
HONG Genshen;WU Jianwei;GAO Xiangdong;WANG Xu
..............page:33-35
The Technique of 3.0μm P-well Spice Model Building
CHEN Peicang;KOU Chunmei;ZHU Hong
..............page:36-39,48
Research on Silicon Nitride Films Deposited by PECVD Technology
WANG Wenjun;SUN Jianjie;ZHU Saining;ZHANG Shiquan
..............page:40-43
Audio Signal Processor with Noise Suppression
WANG Haibing
..............page:44-48