1681-1070
2013 Issue 10
..............page:10-13
A Study on Process Conditions and Properties of TiSi Field Plate
XU Shuai;XU Zheng;WU Xiaodong
XU Shuai;XU Zheng;WU Xiaodong
..............page:33-35
Process Optimization for Technology of Micro Assembly in Millimeter Wave RF Interconnection
REN Rong;LU Shaoying;ZHAO Dan;XIE Qilin;QIU Yingxia
REN Rong;LU Shaoying;ZHAO Dan;XIE Qilin;QIU Yingxia
..............page:1-4,9
Study of Plane Zero-shrink LTCC Substrate Manufacturing Process
HE Zhongwei;GAO Peng
HE Zhongwei;GAO Peng
..............page:14-18
ji yu fpga de dds shi xian
zhang yu jie ; zhi min
zhang yu jie ; zhi min
..............page:31-32,43
Detect the Remark Plastic ICs on the Basis of Packaging Technology
YANG Cheng;ZHANG Ji;MA Qingtao;PAN Lingyu
YANG Cheng;ZHANG Ji;MA Qingtao;PAN Lingyu
..............page:5-9
Design of High Power Factor Correction Circuit Design Based on L6563
CHEN Ping;ZHENG Ailian
CHEN Ping;ZHENG Ailian
..............page:23-26
Analyse and Simulation of a Thermal Variable MEMS Capacitor
CHEN Lijun;SHEN Jiaoyan;LEI Ming;CHEN Jie;TANG Jianping
CHEN Lijun;SHEN Jiaoyan;LEI Ming;CHEN Jie;TANG Jianping
..............page:40-43
Match Circuit Design of S Band 10 W LDMOS Power Transistor
WANG Tao;PAN Jianhua;XU Zheng
WANG Tao;PAN Jianhua;XU Zheng
..............page:27-30
Application of High Voltage BiCMOS Process in Driver IC Design
WANG Wei;LU Xiaomin
WANG Wei;LU Xiaomin
..............page:36-39,48
Batch Type Non-selective Hemispherical Grain Polysilicon Loading Effect and Solution for Stacked DRAM Mass Production
FAN Jianguo;JI Fengqiang;CAI Danhua
FAN Jianguo;JI Fengqiang;CAI Danhua
..............page:44-48
A Design of Bipolar Low Dropout Voltage Linear Regulator
HE Ying;TU Limin
HE Ying;TU Limin
..............page:19-22,26