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Electronics and Packaging
1681-1070
2013 Issue 1
Static Power Analysis and Decrease Technology of FPGA
cao zheng zhou ; cao zuo
..............
page:26-29
Design of Cascaded Current Disturbance Generator
zhao xiao ying ; zhao rui bin ; zhang yi bo
..............
page:30-33
The Solution of Particle Improve for Silicon Oxidation
yang xu min ; shi guo yong
..............
page:34-37
Study on Long-time Reliability of IC’s
nie ji ping
..............
page:38-40
ERP Production Planning Module Status, Problems and Optimization Research
dong peng ; zhang xiao liang ; li guang hui ; ma lu jian ; li peng ju ; chen he zuo
..............
page:41-48
A Review on Wire Bonding Process in Electronic Manufacturing
zong fei ; wang zhi jie ; xu yan bo ; ye de hong ; shu ai peng ; chen quan
..............
page:1-8
Effect of the Thickness of Copper Coating on the Oxidation Resistance of Bare-copper Leadframes
zhang hu jun ; zhang jin bing ; an fei ; lei yu heng ; wen li ; liu dian long ; li xi zhou
..............
page:9-11
Study of Wire-bond Void Formation During High Temperature Aging
yang jian sheng
..............
page:12-16
The Measuring Method for Differential Signal
wang zheng yu ; zhang shao yun
..............
page:17-19
The Design of Bipolar Tri-state Digital Signal Generator
zhang zhi yang ; zhou xiang hong
..............
page:20-25