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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2012 Issue 12
Sources and Effects of AMC in Clean Rooms
pan wen wei ; cai lei
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A Novel COB Package Structure for LED Module
li wei ping ; xie zhi guo ; wu jian guo
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Analysis of Simultaneous Switching Noise in Multi-layer Package Substrate
wang hong hui ; sun hai yan
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Characteristic Parameter of FRED and R&D of Epitaxial Layer
ma lin bao ; xiao zhi qiang ; gu ai jun
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The Influence Factors Analysis of Flux Cleaning after Ball Mounting in CBGA Package
jiang xue ming ; lin peng rong ; lian bin hao ; yao quan bin
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Preparation of Thermostable and Moisture-Proof Epoxy Encapsulant
luo yong xiang ; shi yi wu ; xu xi zuo ; wu ben jie
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ESD Protection Issues in IC Design
cao yan jie ; wang yong ; zhu zuo ; hua meng zuo ; wu hai hong ; zhang yong
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SEM Application Examples in Semiconductor Technology Research
wang zuo yu ; liu jian ; ning run tao
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Research on Reliability of Ball/Column Re-Attachment of CBGA/CCGA ICs
ding rong zuo ; yang zuo bo ; chen bo ; zhu zuo ; gao na yan
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