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Electronics and Packaging
1681-1070
2012 Issue 1
Study of the Single-event of PD SO1 BTSNMOS by 3-D Simulation
xu jing ; chen zheng cai ; hong gen shen
..............page:28-30,36
The Impact of Antenna Effect in Process to Output IV Curve of LPNP Transistor
zheng ruo cheng ; tang sai zuo
..............page:25-27,48
The Research of Packaging Technoligies in Stacking Chips
li bing wang ; xu chun ye ; ou yang jing qiao
..............page:7-10
xin chun ji yu
..............page:F0002-F0002
Research and Development of Halogen Free Flame Retardant Epoxy Molding Compounds
song tao ; li zhi sheng ; feng qi li ; wang chao ; liu jin gang ; yang shi yong
..............page:1-6
Studies on Structural of Long Wavelength Infrared InAsSb Materials
du chuan xing ; gao yu zhu ; gong xiu ying ; fang wei zheng
..............page:14-16,24
Discussion of Repairing Circuit Board of Test System
yao rui ; xu chao
..............page:17-20,24
Verification of Purchased Product
yang jin nan ; tan jian liang
..............page:37-38,48
Study on High Power Integrated Amplifier Module
liu di ; liu hong tao ; he ling
..............page:21-24
The Application of Strained Silicon in the Nano CMOS Technics
liu guo zhu ; yao fei ; wang shu jie ; lin li
..............page:31-36