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Electronics and Packaging
1681-1070
2011 Issue 8
Optimize of High Concentration of BBr_3 Process
li jian hui ; zhuang ze liang
..............page:29-31
Research on the Influence the Design for PAD over Wire Bonding
ma wan li ; jin bo
..............page:1-3,14
Research on High-precision Algorithm for Localized Wireless Positioning System
wei bin ; luo ; yu zhi guo ; huang zhao jun
..............page:25-28
Analysis and Control of Internal Gas for Hermetic Package
feng da ; li xiu lin ; ding rong zuo ; wang yang ; ming xue fei
..............page:10-14
Reaseach of Vacuum Reflow Soldering with Sn-3.0Ag-0.5Cu Solder
gao wei na ; hu feng da ; chen ya rong
..............page:15-18
The Design of ISP Download-line for AT89S Series Single-chip
li zu ming ; tang hui
..............page:22-24
Study on the Methods to Improve IC Package Design Reliability
hu jian zhong ; jin ling
..............page:37-39
Preparation of GPTMS/ TiO_2-ZrO_2 Habrid Materials with High Refractive Index by Sol-gel Process
huang min ; huang zuo hua ; lin xiao dan ; zeng xing rong ; li qiao long ; liu zhi meng ; liu zuo ping
..............page:32-36
The High Precision of Conversion-core Design in ADC
xu xin yu ; huang zuo zuo ; xu zuo
..............page:19-21,48
TPMS Pressure Sensor YAPS10
bi xiang dong ; jin ling
..............page:43-46
TO-220FS Production Development and Manufacture
zhang hua hong ; zuo sheng hu
..............page:40-42
The Component Ingredients Optimization of Non-rosin-based and Halogen-free Solid Flux
cheng fang jie ; ma zhao long ; ge wen jun
..............page:4-9