Electronics and Packaging 2011 Issue 12 sgs yu guo jia ban dao ti guang yuan chan pin zhi liang jian du jian yan zhong xin da cheng zhan lue he zuo

Home | Survey | Payment| Talks & Presentations | Job Opportunities

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronics and Packaging
1681-1070
2011 Issue 12

sgs yu guo jia ban dao ti guang yuan chan pin zhi liang jian du jian yan zhong xin da cheng zhan lue he zuo

..............page:46-47

de zhou yi qi ti tui chu tms320c66x duo he dsp xin pin

..............page:24-24

rui de re li xun hui yan tao hui zai zhong guo da shou huan ying

..............page:7-7

The Design of Multicenter Data Sampling System Based on 8051 Core
yang bing ; tao wei ; li jiang da

..............page:15-17,20

The Treat and Reuse Technology of Organic Waste Water Containing Heavy Metal
fei jun min ; ren xiao zhe

..............page:32-35

The Research and Evaluation of LED Thermal Interface Materials
zhuang mei lin ; wang feng ; qian jing ; qian zuo lei ; li shu zhi ; ma ke jun

..............page:25-28

semi guan yu jin qi tai yang neng guang fu mao yi fa zhan de sheng ming

..............page:45-46

tiadc qu dong qi she li gong hao xing neng xin biao zhun

..............page:47-48

Design of C Band Highly Stabilized CRO
wang hong mei ; wen yan bing ; wang yi gang ; ma jian jun

..............page:12-14

Research on the Key Technologies of Cascaded STATCOM in Large City Power
zhao li ; jin li ming ; ye wei hua ; chen tao ; zhao bo ; zhu jun xing

..............page:21-24

microsemi zeng qiang kang fu she hang tian chan pin zhen rong

..............page:31-31

dian zi yu feng zhuang 2011 nian di 11 juan 1 12 qi mu ci suo yin

..............page:I0001-I0008

hai xia liang an ruan jian he ji cheng dian lu feng hui zai jiang su wu xi ju xing

..............page:45-45

xin si ke ji synopsys xuan bu shou gou wei jie ma she ji zi dong hua you xian gong si

..............page:45-45

Research of Signal Integrity of Interconnection in IC Packaging
gao xue lian ; chen yin hong ; lei xiao ming

..............page:1-3,44

zhou zheng yu bo shi jiu ren ju li ji cheng xin shou xi zhi xing guan

..............page:46-46

samplify systems gong si fa bu di yi kuan shang yong chao sheng bo shu he cheng asic zhuan yong xin pian

..............page:48-48

mo shi zai zhen jiang kai she xin de she pin zu jian ji zhuang pei chang

..............page:39-39

Research on Au/Sn Eutectic Sintering Technology of Die Attachment and Remelting Air-tightness
ge qiu ling ; ding rong zuo ; ming xue fei

..............page:4-7

The Check of BP-2B Busbar Differential Protection
zou san hong ; liu dun ; zhang qing li ; fang xiao

..............page:40-44

ok guo ji tui chu quan xin de mrs-1000 xi tong sheng ji ban

..............page:48-48

Low Cost VLSI Design of a Flexible FFT Processor
dai yi qi

..............page:8-11

The Research of Distribution Network Production Command System and Information Exchange
ye wei hua ; wang yong feng

..............page:36-39

an jie lun tui chu ju bei qian mian ban bian cheng neng li de san lu shu chu dian yuan

..............page:48-48

The Simulation and Analysis of the Circuits Using Integrated Operational Amplifier Based on MultisimlO
zeng wei

..............page:18-20

guang da dian nao cai yong rui de dui liu hui liu xi tong da da ti gao liao sheng chan li

..............page:11-11

Influence of the Properties of Conductive Adhesive on Delamination of the Devices
shi hai zhong ; zhang xue bing ; zhang zuo zuo ; nie lei

..............page:29-31