Electronics and Packaging 2011 Issue 11 ok guo ji tui chu gong neng qiang da de chai han xi tong yi ji du te de sheng ji tao jian

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Electronics and Packaging
1681-1070
2011 Issue 11

ok guo ji tui chu gong neng qiang da de chai han xi tong yi ji du te de sheng ji tao jian

..............page:28-28

an jie lun zai 4g world da hui shang zhan shi yong yu lte msr yi ji mimo de ce shi jie jue fang an

..............page:32-32

asm tai ping yang ke ji you xian gong si zheng shi wan cheng xi men zi smt tie pian ji bu men de jie shou gong zuo

..............page:45-46

semichina zai imaps2011 shang jie shao fen xi zhong guo ban dao ti feng zhuang shi chang

..............page:45-45

ai pai ke sen ji zhi jian yue de 8-pin xin pian ding yi dian nao wai she chan ye de ji shu he cheng ben xin gao du

..............page:47-47

The Second Breakdown and Testing of Transistor
wang jing xia ; wang pin ying ; shen yuan sheng

..............page:9-13

ai te mei er fa bu shou kuan ji yu arm cortex-m4 chu li qi de kuai shan wei kong zhi qi yang pin

..............page:13-13

Dynamic Phasors in Modeling and Analysis of PWM DC/DC Converter
ye wei hua ; li fu peng ; wang yong feng

..............page:22-28

li zi dian chi kai guan shi chong dian qi ti gong geng duan de chong dian shi jian he 500mausb otg zhi chi

..............page:46-47

arm yu tsmc wan cheng shou jian 20nm arm cortex-a15 duo he chu li qi she ji ding an

..............page:47-48

0.6μm SOI NMOS ESD Performance Analysis and Application
luo jing ; hu yong qiang ; zhou yi ; zou qiao yun ; chen jia peng

..............page:33-36,40

Study and Improvement on Floating Gate CMP Process in Embedded Flash Memory
li guan hua ; huang qi zuo

..............page:4-8,13

tsmc ling xian ye jie wan cheng xin xi ji suan ji zhong xin iso 50001 neng yuan guan li xi tong yan zheng

..............page:46-46

da tang - an jie lun td-lte-advanced lian he yan jiu shi yan shi cheng li

..............page:48-48

ai te mei er maxtouch mxt1386 zhu li lian xiang ideapad tablet k1 chu mo ping

..............page:48-48

Introduced the Advantages and Disadvantages of the Green Flame Retardant of EMC
li jin ; wang dian nian ; yuan lu lu

..............page:41-44

ri yue guang ji tuan zong bu zai shang hai ju xing kai gong dian li

..............page:45-45

Design of Sample-and-hold Circuit for a Pipeline ADC
zhou jia ning ; li rong kuan

..............page:18-21,32

te dian lu bao hu bu tui chu xin yi dai di dian zu gao dian liu ke hui liu han re bao hu rtp qi jian

..............page:47-47

A Study on De-flash Solution pH Change Affect De-lamination between IC EMC and Lead Frame
pu bin yuan ; cheng xiu lan

..............page:37-40

Research of LVDS Test Technology
chai hai feng ; zhu wei liang ; zhang hui bin ; wu qian wen

..............page:14-17

Analysis on the Influence of the Downset of Die Pad on Pinhole
shi hai zhong ; chen qiao feng ; zhu jin hui ; jia hong mei

..............page:1-3,17

Design of High Speed Data Acquisition System with Pipelined ADC
huang feng

..............page:29-32

di san jia an jie lun ke ji dian zi ce liang yi qi ti yan dian zheng shi yu zhong guo shen zuo cheng li

..............page:40-40