1681-1070
2011 Issue 1
An Analytical Model for Modulation in Passive UHF RFID Transponder
ZHOU Yi;LUO Jing;GUI Jiang-hua
ZHOU Yi;LUO Jing;GUI Jiang-hua
..............page:29-32
Design and Manufacture Techniques of 3cm-T/R Module
LI Jun-sheng
LI Jun-sheng
..............page:9-12
..............page:4,12,21,32,44-48
Low Power Technology Implementation in DSM on SoC
WANG Dong;CAI Hong
WANG Dong;CAI Hong
..............page:37-40
Aluminum Ribbon:New Interconnect Technology for Small Power Devices
LIE Pei-sheng;CHENG Ming-jian;WANG Jin-lan;TONG Liang-yu
LIE Pei-sheng;CHENG Ming-jian;WANG Jin-lan;TONG Liang-yu
..............page:5-8,25
Study on Au-Si Bonding of Wafer Level MEMS Vacuum Packaging
ZHANG Zhuo;WANG Xue-fang;WANG Yu-zhe;LIU Chuan;LIU Sheng
ZHANG Zhuo;WANG Xue-fang;WANG Yu-zhe;LIU Chuan;LIU Sheng
..............page:1-4
Design of Driving-display Based on MCU and VRAM Color LCD
CHENG Xiu-ping;LIU Zhong-chao
CHENG Xiu-ping;LIU Zhong-chao
..............page:41-43
Latest Development in Pipelined ADC
CHEN Biao;JIANG Si-xiao;ZHOU Jie;ZHANG Jian;XU Zi-ming;CHEN Zhen-hai
CHEN Biao;JIANG Si-xiao;ZHOU Jie;ZHANG Jian;XU Zi-ming;CHEN Zhen-hai
..............page:13-17
Study on the EPROM Data Retention Capability Evaluation
XU Hai-tao;WANG Zhi-yong
XU Hai-tao;WANG Zhi-yong
..............page:33-36
The MBIST Architecture for SOC
GUI Jiang-hua;QIAN Li-ming;SHEN Bai-quan;ZHOU Yi
GUI Jiang-hua;QIAN Li-ming;SHEN Bai-quan;ZHOU Yi
..............page:26-28,36
..............page:封2
Integrated Verification for SOC Based VMM
LI Lei;LUO Sheng-qin
LI Lei;LUO Sheng-qin
..............page:18-21
..............page:22-25