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Electronics and Packaging
1681-1070
2010 Issue 8
The Radiation Effects and Hardened Technologies of Semiconductor Device
zhao li ; yang xiao hua
..............
page:31-36
A Low Power 64 Fold Down-sampling Multi-stage Digital Filter Design
mei hai jun ; wu jin ; nie wei dong ; zhang zuo ; li xiao meng
..............
page:21-26
Reliability Evaluation of AL Stain after Contact Eatch at Wet Strip Resist
chen pei cang ; zheng ruo cheng ; xu zheng
..............
page:41-43,47
xin xi dong tai
..............
page:48
Design of an Atatic-CMOS based Digital-Controlled Oscillator
zhou guo fei ; gong min ; zuo qi rong
..............
page:27-30
Etching of 0.8μm Polycrystalline Gate with Enhanced Plasma
wang chun dong ; li xing he ; gu ai jun ; zhao jin ru ; liu guo zhu
..............
page:37-40
Design and Realization of Real-time Detector on Power Frequency
zhang xue qun
..............
page:44-47
Application of Copper Wire Bonding Technology in Semiconductor Packaging Industry
bi xiang dong
..............
page:1-4,13
Study of Failure Mode and Failure Mechanisms on Flip-Chip Ceramic Packaging
ren chun ling ; gao na yan ; ding rong zuo
..............
page:5-9
Design of a CMOS Ultra-Wideband Low Noise Amplifier
xu guo ming
..............
page:17-20
Research on the BIT Test Scheme for Several Functional Circuits
guo han qiao ; zuo li li
..............
page:14-16,20
How to Prevent the Side Set or Turn over in Taping of SOD Series Products
chen ju hua
..............
page:10-13