1681-1070
2010 Issue 6
Research of Ku-band 20W AlGaN/GaN Internally Matched Power HEMT
sun chun mei ; zhong shi chang ; chen tang sheng ; ren chun jiang ; jiao gang ; chen chen ; gao tao
sun chun mei ; zhong shi chang ; chen tang sheng ; ren chun jiang ; jiao gang ; chen chen ; gao tao
..............page:23-25,38
The Reasons for Potential Safety Hazards of Household Appliances and Its Preventive Measures
yu hong feng
yu hong feng
..............page:42-44,47
..............page:48
Interfacial Reactions in Lead-free Solders with Au/Ni/SUS 304 and Alloy 42 in Microelectronic Packaging
yan zuo wen ; liu wei kai
yan zuo wen ; liu wei kai
..............page:1-5,11
..............page:14,18,22,38,45-47
The Technics Parameters Analysis of Affecting Parallel Sealing
guo jian bo ; sun yin hu ; su xin yue
guo jian bo ; sun yin hu ; su xin yue
..............page:12-14
Emerging Trends in Packaging of Electronic Devices
huang qing hong
huang qing hong
..............page:8-11
..............page:19-22
The Study and Design of Foot-use Mouse
xu wen wu ; xu mei ; cai ben xiao
xu wen wu ; xu mei ; cai ben xiao
..............page:39-41
The Technology based on Deep Trench Dielectric Process for The High Density Capacitance
huang yun ; gao xiang dong
huang yun ; gao xiang dong
..............page:26-28
Reliability Analysis of Silicone Rubber in Package Assembly
huang ju qin ; zuo ni zuo
huang ju qin ; zuo ni zuo
..............page:35-38
FPGA_based Design of Embedded SRAM Block
hu xiao qin ; zhao jian ming ; xiao pei lei
hu xiao qin ; zhao jian ming ; xiao pei lei
..............page:15-18
..............page:6-7,11
A Study on Epitaxial Process of High-speed BiCMOS
wu bing ; xue zhi min ; wang qing bo ; chen bao zhong
wu bing ; xue zhi min ; wang qing bo ; chen bao zhong
..............page:29-34