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Electronics and Packaging
1681-1070
2010 Issue 3
Universal Serial Bus Protocol Analysis and Verification
sun yi qin
..............
page:14-18
The Study of RF MEMS Switch Technology
wang ji fang ; liu shan xi
..............
page:27-31
The Research of Design and Making for Metal-ceramic Pageage
hu jin ; lu hui xiang ; cheng kai
..............
page:5-8
The Research of Radiation Mechanism on EEPROM Cell
wang xiao ling ; zhang guo xian ; zhou zuo jie
..............
page:19-22
The Study on Silicon Grinding Technology
mu rui qiang ; liu jun ; cao yu sheng
..............
page:9-13
dian zi yu feng zhuang za zhi zheng gao qi shi
..............
page:48
The Applications of PPF Leadframe which be Used on Semiconductor Industry
li qing sheng
..............
page:36-39,43
Design and Implementation of Accessory of Rice Cooker with Energy Conservation and Environmental Protection
xu wen wu
..............
page:40-43
The Stress Distribution Analysis of Stand-off between Chip Component and Substrate on SnAgCu Solder Joint
yang jie
..............
page:1-4
Examine and Repair of JC-3196 Test System
yao rui ; zhou chun
..............
page:32-35
Research of Mental Oxide Gas Senor
shen xiao dan ; cheng dong ming ; wu jing jing ; yang guang zuo
..............
page:23-26,31
xin xi bao dao
..............
page:4,13,18,22,43-47