1681-1070
2010 Issue 11
..............page:14,18,21,25,44-48
Eutectic Soldering in the Vacuum
HUO Zhuo-qin;YANG Kai-jun
HUO Zhuo-qin;YANG Kai-jun
..............page:11-14
..............page:39-43
A High Linearity CMOS Bootstrapped Sampling Switch
PAN Xiao-min;HUANG Yan-ping;CHEN Zhen-hai
PAN Xiao-min;HUANG Yan-ping;CHEN Zhen-hai
..............page:29-32,35
Research of the Green Compound of SD Card
WANG Dian-nian;LI Jin;GUO Ben-dong
WANG Dian-nian;LI Jin;GUO Ben-dong
..............page:19-21
Debounce Switch Study and Design
HUANG Qiu-ping;WANG Han-xiang;LI Fu-hua
HUANG Qiu-ping;WANG Han-xiang;LI Fu-hua
..............page:26-28,43
The Study for Medical MEMS Sensor Special Assembly Technical
WANG Lun-bo;ZHANG Zhen-lin
WANG Lun-bo;ZHANG Zhen-lin
..............page:15-18
WSN SoC Verification Platform Based on FPGA
YU Zhi-guo;HUANG Zhao-jun;CHEN Zi-feng;WAN Shu-qin;WEI Bin
YU Zhi-guo;HUANG Zhao-jun;CHEN Zi-feng;WAN Shu-qin;WEI Bin
..............page:22-25
Damage Critical Point of Lead-free Solder Joint Detected On-line base on Resistance Strain
JIANG Li;PAN Yi;ZHOU Zu-xi
JIANG Li;PAN Yi;ZHOU Zu-xi
..............page:1-4,10
..............page:33-35
..............page:36-38
..............page:5-10