Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics and Packaging
1681-1070
2010 Issue 10
8ns 4M_bit Reliability of Static Random Access Memory
WANG Yan;ZHOU Yun-bo;ZHANG Guo-xian;YANG Xiao-hua
..............page:16-20
Study of Wire Crack in Tensile Tests
YAO Li-hua
..............page:31-34
Investigation on Electrical Characteristics of Ni(W)Si/Si Schottky Barrier Diode
WANG Sheng;HUANG Wei;ZHANG Shu-dan;XU Ju-yan
..............page:24-27
New 3D Vertical Interconnect Technology with MMIC
ZHENG Wen-qian;SHEN Ya
..............page:1-4
The Revolution of Light Source in the Projection System
QIU Yong-hua
..............page:44-46,48
Application of SPC in Etching Process in the Microcircuit Fabrication
ZHAO Jin-ru;WANG Chun-dong;QIN Yong-wei;LI Jun
..............page:35-37,43
Electrode Modification Research of Organic Solar Cell
WU Jing-jing;CHENG Dong-ming;SHEN Xiao-dan;YU Zhen-fang
..............page:38-43
Electrostatic Protect in the Process of Silicon Wafer Cleaning
LI Yun-hai;LI Xin-yan;ZHANG Wen;DING Rong-zheng
..............page:28-30
The Application of LCP Substrate for Microwave/Millimeter-Wave System Packaging
ZENG Ce;GAO Neng-wu;LIN Yu-min
..............page:5-8
Design of Hyperthermia Instrument based on FPGA
JIANG Shuang-yan;HUANG Qiu-ping
..............page:21-23,27
SOT 82 Production Development and Manufacture
ZHANG Hua-hong;ZHANG Shao-fang
..............page:9-11,20
Research of Digital IC AC Test System based on FPGA
LIU Feng-wei;ZHAN Hui-qin;GU Jun
..............page:12-15
xin xi dong tai
..............page:34,47-48