1681-1070
2009 Issue 9
Wafer Grinding Technology in 3D Package
JIANG Jian;ZHANG Zheng-lin
JIANG Jian;ZHANG Zheng-lin
..............page:1-4,11
The Thickness Measure of the Double EPI Layers Wafer
TANG You-qing;TAN Wei-dong;MA Li-xing;YANG Fan;ZHANG Wen-qing
TANG You-qing;TAN Wei-dong;MA Li-xing;YANG Fan;ZHANG Wen-qing
..............page:5-7
..............page:43-45
..............page:24,46-48
Reliability Technology and Development of Optical Devices for Space
LUO Yan-heng;ZHANG Rui-jun
LUO Yan-heng;ZHANG Rui-jun
..............page:38-42
Numerical Simulation Under Temperature Cycling for QFP Solder Joint
LI Zhi-hai;LI Wen-shi
LI Zhi-hai;LI Wen-shi
..............page:31-34
Research on Strength Enhancement of Epoxy Molding Compound
ZHOU Hong-tao;HUANG Wen-ying
ZHOU Hong-tao;HUANG Wen-ying
..............page:35-37
ESD Protection Structure Design
ZHENG Ruo-cheng;LIU Cheng-qi
ZHENG Ruo-cheng;LIU Cheng-qi
..............page:28-30,48
A High Speed & Resolution Track-and-hold Circuit for Pipelined A/D Converter
WANG Hai-zhu;WANG Ji-an;YANG Jian-hong;CHE Hong-rui
WANG Hai-zhu;WANG Ji-an;YANG Jian-hong;CHE Hong-rui
..............page:20-24
Design of a Card Switcher Based Photoelectric Recognition
XU Wen-wu;CAI ben-xiao
XU Wen-wu;CAI ben-xiao
..............page:25-27
..............page:8-11
Introduction of Non-destructive Decapsulate Technology for Plastic Encapsulated Microchips
YIN Ying;ZHU Wei-liang
YIN Ying;ZHU Wei-liang
..............page:12-15,19
The Design of Low-power DDS Circuit
WANG Li-xiu;ZHANG Tao
WANG Li-xiu;ZHANG Tao
..............page:16-19