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Electronics and Packaging
1681-1070
2009 Issue 8
The Technics Research of Copper Wire Bonding
CHANG Hong-jun;WANG Xiao-chun;FEI Zhi-xia;MU Wei;LI Xi-zhou;FENG Xue-gui;LU Ming-zhen
..............
page:1-4,15
Open Short Fail in Final Test and Solution
ZHANG Ya-jun;CHEN Li-xin
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page:9-11
Effect of Solder Pad Size on Solder Joint Reliability upon Flip Chip PBGA Packages
YANG Jian-sheng
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page:5-8
Improve Polysilicon Resistor Process Stability
WE Jian-wei;JIANG Yue-yan;HE Qi;WANG Chuan-bo
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page:38-42
Space Radiation Environment and Resist-Radiation Hardening Technology Progress of Optical Devices
LUO Yan-heng;ZHANG Rui-jun
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page:43-47
xin xi bao dao
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page:23,42,48
The Generation and Control of Hydrogen in Sealed Devices
WU Wen-zhang;BAI Hua;LIU Yan-fang;SUN Xu-peng;SONG Yan
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page:34-37
The Optimization of SOI Layout
XU Da-wei;DAI Chang-mei;CHEN Hui-rong;ZHANG Yong-rong
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page:31-33
Research on Via Design in High-speed PCB
HOU Ying-ying;GUAN Dan-dan
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page:20-23
Progress of SONOS Nonvolatile Memory Device
ZENG Jun;FU Ren-li;SONG Xiu-feng;ZHANG Shao-dong;QIAN Feng-jiao
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page:24-30
The Design and Achievement of a 16-bits Delta-sigma Modulator
LIU Qiu-liang;LI Wen-yuan
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page:16-19,33
Full-custom Layout Design of Direct Digital Frequency Synthesizer in 0.18 μ m CMOS
ZHANG Gan-ying;WANG Li-xiu;CHEN Zhen-hai
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page:12-15