1681-1070
2009 Issue 7
..............page:1,7
diao zheng zhong zheng he wei ji zhong zhong sheng jia da dui ban dao ti feng ce chan ye de zheng he li du
yu zuo kang
yu zuo kang
..............page:2-7
Analysis and Comparison of Thermal Stress and Hygrothermal Stress of Lead-free Flip Chip Solder Joint
ZHOU Xiang;WANG Ying-hai;YUAN Li-juan;LI Hong-yi;WANG Dong
ZHOU Xiang;WANG Ying-hai;YUAN Li-juan;LI Hong-yi;WANG Dong
..............page:8-12
Concerning on Mold Flash Issues of IC Plastic Packaging
MU Wei;ZHOU Chao-feng;MENG Hong-Wei;LI Xi-zhon;FENG Xue-gui;LU Ming-Zhen
MU Wei;ZHOU Chao-feng;MENG Hong-Wei;LI Xi-zhon;FENG Xue-gui;LU Ming-Zhen
..............page:13-16,21
Thermal Conductive Performance and Thermal Simulation of High Thermal Conductive Epoxy Molding Compound
SHI Zhi-xiang;FU Ren-li;ZENG Jun;ZHANG Shao-dong
SHI Zhi-xiang;FU Ren-li;ZENG Jun;ZHANG Shao-dong
..............page:17-21
Design of a Power Boosting VFM DC-DC Converter
WAN Qing;WANG Sheng;WANG Cheng
WAN Qing;WANG Sheng;WANG Cheng
..............page:22-25,36
Latest Development in Embedded High Speed ADC
DENG Qing;CHEN Zhen-hai;ZHU Yan-jun;WU Jun
DENG Qing;CHEN Zhen-hai;ZHU Yan-jun;WU Jun
..............page:42-45,48
90nm T-gate Lattice Matched InAIAs/InGaAs/InP HEMTs
GAO Xi-qing;GAO Jian-feng;KANG Yao-hui;ZHANG Zheng
GAO Xi-qing;GAO Jian-feng;KANG Yao-hui;ZHANG Zheng
..............page:34-36
SIPOS Process Technology and Stability
WEI Dun-lin
WEI Dun-lin
..............page:37-41
Reference Voltage Based on Bandgap Reference for Accelerometers
TAN Xiao-yun;WANG Li-ying;LIU Xiao-wei;JIANG Yi-ming;CHEN Wei-ping
TAN Xiao-yun;WANG Li-ying;LIU Xiao-wei;JIANG Yi-ming;CHEN Wei-ping
..............page:26-30
A Comparison of the Automatic Circuit Imbalance Compensation
YANG Shi-hua;LI Wen-yuan
YANG Shi-hua;LI Wen-yuan
..............page:31-33
..............page:12,21
The Water Level Detection System Using Capacitance Sensor in SOlar Water Heater
XU Wen-wu;CAI Ben-xiao
XU Wen-wu;CAI Ben-xiao
..............page:46-48