Electronics and Packaging 2009 Issue 4 Study of the Dispersion and Toughness on the Epoxy Molding Compound with Core-shell Elastic Panicles

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Electronics and Packaging
1681-1070
2009 Issue 4

Study of the Dispersion and Toughness on the Epoxy Molding Compound with Core-shell Elastic Panicles
ZHOU Fang;TAN Wei;WU Juan;DING Dong;QIN Su-qiong

..............page:1-3,24

The Packaging Structure and Development Trend of Intelligent/smart Power Module
ZHANG Yu-qiu;LIU Yu-min

..............page:4-7,39

Optimization of SPC Control Limit Calculation Method of Assembly Process
WANG Ting-qin

..............page:8-12

Research and Development of Recycling of Plastics from Waste Electrical and Electronic Equipment
ZHANG Xiu-min

..............page:40-43,48

Optimization of HMDS Vapor Prime Oven Pre-process
ZHANG Ming-ming

..............page:37-39

The Main Factors Causing Die Crack in IC Assembly Process
WU Jian-zhong;ZHANG Lin-chun

..............page:33-36

The Software Technology of Anti-interference in the Single-chip Microprocessor
YI Li-hua;HUANG Jun

..............page:30-32

Design of a Radiation Hardened Aero-bus Transceiver
WANG Yi-zhu;XUE Hai-Wei

..............page:25-29

High-power LED Lighting Circuit's Characteristics and Driver Design
WANG Ya-fang

..............page:20-24

The System Design Based on the System C
WU Xiao-jie

..............page:17-19

The Research of Conducting Adhesive and Thickness of Chip in the Black Ceramic Packaging Hermetic Sealing Process
WU Yong-cai

..............page:13-16