1681-1070
2009 Issue 3
High-density IC Packaging Based on Flexible Printed Circuit
LIU Xu-lei;ZHOU De-jian;LI Yong-li
LIU Xu-lei;ZHOU De-jian;LI Yong-li
..............page:1-5,14
Quality Inspection and Control Technology of CBGA Solder Ball On-line
YANG Bing;DING Rong-zheng;TANG Tao-kou
YANG Bing;DING Rong-zheng;TANG Tao-kou
..............page:6-10,31
A Study of Hot Carrier Effects on Polysilicon Thin Film Transistors by Simulation
TAO Jing-jing;CEN Chen;LIU Xiao-hong;GU Xiao-feng;ZHONG Chuan-jie;YU Zong-guang
TAO Jing-jing;CEN Chen;LIU Xiao-hong;GU Xiao-feng;ZHONG Chuan-jie;YU Zong-guang
..............page:11-14
Flip Chip Technology and Its Application
REN Chun-ling;LU Kai;DING Rong-zheng
REN Chun-ling;LU Kai;DING Rong-zheng
..............page:15-20
The Study and Design on 64kB EEPROM
DU Zhi-hua;TAO Yu-feng;WANG Xiao-ling;CHEN Fang
DU Zhi-hua;TAO Yu-feng;WANG Xiao-ling;CHEN Fang
..............page:21-23,26
..............page:24-26
Research of Reliability for Metal Package's Wire Bonding
ZHANG Qi;YAO Li
ZHANG Qi;YAO Li
..............page:27-31
ESC's Influence to Production in Poly Etch and Methods to Improve ESC's Lifetime
DONG Jia-wei;HUANG Qi-yu
DONG Jia-wei;HUANG Qi-yu
..............page:32-35
Research on Delamination of Plastic Encapsulated Integrated Circuits
WU Jian-zhong;LU Zhi-fang
WU Jian-zhong;LU Zhi-fang
..............page:36-40,48
..............page:41-44