Electronics and Packaging 2009 Issue 1 Process Adjustment of the Black Ceramic Packaging Sinter

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronics and Packaging
1681-1070
2009 Issue 1

..............page:1-6

Research and Development of Positive-working Photosensitive Polyimides (2)
LIU Jin-gang;YUAN Xiang-wen;YIN Zhi-hua;ZUO Li-hui;YANG Shi-yong

..............page:7-11,23

Electrical Simulation Research for IC Package Via
DU Shu-an;YAO Quan-bin;LIU Jun

..............page:12-15

..............page:16-19

A Latch-up in Bipolar Circuit
ZHOU Ye;LI Bing

..............page:20-23

A Gbps High Speed LVDS Transmitter in CMOS Technology
JI Hui-cai;CHEN Zhen-hai;SUN Hua;ZHANG Gan-ying

..............page:24-27

Research and Design of SOC DFT
YANG Bing;WEI Jing-he;WANG Guo-zhang;YU Zhi-guo

..............page:28-31,45

..............page:32-34

Heat Dissipation Analysis of High Power LED Based on Thermoelectric Cooler
TIAN Da-lei;GUAN Rong-feng;WANG Xing;ZHAO Wen-qing

..............page:35-37

Finite Element Analysis on Dry Baking of Plastic IC Components
DING Xiao-yu;XIANG Dong;YANG Ji-ping;DUAN Guang-hong

..............page:38-41

An Improved PWM Modulation for Filterless Class-D Amplifier
JIANG Yi-qiang;SHA Shao-dong;NIE Wei-dong

..............page:42-45