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Electronics and Packaging
1681-1070
2008 Issue 8
The Course and Development of PLD
PAN Rui-jie;CHEN Biao;LIU Xi-an
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page:44-48
Research on ESD Protection Circuit with Vertical NPN Structure in Submicron BiCMOS Technology
WANG De-jin;NIE Wei-dong;ZHANG Wei;LI Bing
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page:39-43
The Work Principle and Device Structure of Feram
MA Liang
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page:35-38
The Logic Analysis of I2C Bus Interface
RUAN Yuan;LI Jing
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page:31-34
Design of a 12-bit 25MS/s Sample and Hold Circuit
ZHONG Tao;LI Ying;CHEN Zhen-hai
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page:28-30,34
The Behavioral Level Simulation of a 2-1-1 MASH ∑-△ Modulation
YANG Dong-ze;WU Jin
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page:22-27
Design of SoC Development Interface Based on JTAG
ZHANG Meng-hua;ZHANG Tao;ZHANG Peng
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page:18-21,27
Research on Test Technology of DMAD on V777 Test System
LU Qiang;SUN Xiao-li
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page:13-17
Challenges of the Transformation from PBGA to FBGA
WANG Ting-qing
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page:9-12,17
On the Reliability of the Sn-Ag-Cu Solder Material
HOU Rui-tian
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page:5-8
Parallel Seam Welding and Lids
HOU Zheng-jun;SONG Bei-gang;DING Peng
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page:1-4,8