1681-1070
2008 Issue 6
Influence of Alloy Lead Frame on Reliability of Electronic Components
HAN Li;JIN Ling;HU Jun
HAN Li;JIN Ling;HU Jun
..............page:39-41
..............page:42-44
..............page:29,41,45-48
The SOI Characteristics and Fabrication of SOI Material
LUO Hao-ping;ZHANG Yan-fei
LUO Hao-ping;ZHANG Yan-fei
..............page:1-5
..............page:6-11
Rework Techniques Process Evaluation for Chip Scale Packages
YANG Jian-sheng
YANG Jian-sheng
..............page:12-16
Studies of Low Voidage Vacuum Welding Technology of the Power Chip
LI Xiao-xuan;HU Yong-fang;YU Sheng-lin;YAN Wei;XU Jun-shan
LI Xiao-xuan;HU Yong-fang;YU Sheng-lin;YAN Wei;XU Jun-shan
..............page:17-20
..............page:21-25,29
A HIC Temperature Control Circuit
DIAO Xiao-ling
DIAO Xiao-ling
..............page:26-29
A Low Power MPEG-1/2 Audio Decoer IP Core
ZHU Zi-yuan
ZHU Zi-yuan
..............page:30-34
A High PSRR Curvature Compensation Bandgap Reference
WU Jin;CHANG Chang-yuan;SHI Chao
WU Jin;CHANG Chang-yuan;SHI Chao
..............page:35-38