Electronics and Packaging 2008 Issue 5 Failure Analysis of the First Wire's Bond and Improvement of its' Bonding Reliability

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronics and Packaging
1681-1070
2008 Issue 5

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Preparation of LTCC P-band 90°Power Divider
JIANG Hai-bo;JIN Hua-jiang;HAO Jin-zhong

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A MVR-CORDIC Based High Speed 64 Point Radix-4 FFT Processor
HOU Wei-hua;GUO Hui;LIU Ming-feng;YU Zong-guang

..............page:22-25

Mixed-signal SoC Verification Technology Based on 8 Bit CPU Core
HUANG Song-ren;WEI Jing-he;YU Zhi-guo;WU Xiao-jie

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xin xi bao dao

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