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Electronics and Packaging
1681-1070
2008 Issue 5
Failure Analysis of the First Wire's Bond and Improvement of its' Bonding Reliability
DING Rong-zheng;YANG Bing;REN Chun-ling;TANG Tao-kou
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page:1-4,25
Control of Automatic Wedge Bonding on First Bond Heel Crack
GUO Da-qi;REN Chun-ling
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page:5-8,33
Analysis of the Influence of Test Point to Wire Bond Bulling Test
LIU Chun-zhi;HE Ling;LIU Di
..............
page:9-11
Preparation of LTCC P-band 90°Power Divider
JIANG Hai-bo;JIN Hua-jiang;HAO Jin-zhong
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page:12-14
A New Packaging Trend:Wafer Level Packaging
HE Jin-qi
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page:15-17
A Switched Capacitor Filter Designed for RDS Signal Processing
WANG Cheng;XU Wei;ZHU Li-jia
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page:18-21
A MVR-CORDIC Based High Speed 64 Point Radix-4 FFT Processor
HOU Wei-hua;GUO Hui;LIU Ming-feng;YU Zong-guang
..............
page:22-25
Mixed-signal SoC Verification Technology Based on 8 Bit CPU Core
HUANG Song-ren;WEI Jing-he;YU Zhi-guo;WU Xiao-jie
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page:26-28
Design and Development of Data Preparation System
XIAN Fei
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page:29-33
Application of Interval Algorithm in the Electrical Network Design
YANG Wei-feng;ZENG Fang-ling
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page:34-37,41
Developmental Trend of the World Semiconductor Industry in Recent Years
WENG Shou-song
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page:38-41
xin xi bao dao
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page:42-47
dian zi yu feng zhuang za zhi zheng gao qi shi
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page:48