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Electronics and Packaging
1681-1070
2008 Issue 3
yi ling xian ji shu zhu li chan ye lian xie diao fa zhan
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page:48
de ke zai semicon china2008 zhan shi zhuo yue feng zhuang ji shu
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page:48
Research on Electronic Ballast for 250W High Pressure Sodium Lamp
CUI Jia-min;QIN Hui-bin;LUO You;ZHAN Lian;LI Ya
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page:22-24,34
Simulation of NMOS Transistor ESD Characteristics
ZHENG Ruo-cheng;SUN Feng;WU Jin
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page:18-21
Fabrication and Property of Aluminum Silicon Carbide Packaging Housing with Metal Seal Ring
XIONG De-gan;YANG Sheng-liang;BAI Shu-xin;ZHUO Yue;ZHAO Xun
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page:14-17,21
Package Failure Mechanism Study for Interfacial Delamination
ZHU Jun-shan;JIN Ling
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page:11-13
Heat Disspation Technology and Its Applications in Electronic Packaging
LONG Le
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page:6-10,13
The Properties of Mechanical Study of Electrically Conductive Adhesive
HAO Xiu-yun
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page:1-5
zhong guo de dian zi zhi zao ye ke chi xu fa zhan
chen ai si
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page:47-48
Discussing Assessment Pattern for IC Packaging & Testing Enterprises' Management
WANG Yi-xian
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page:43-46
High-efficiency UPS without Inverter
CAI Ming-xiong
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page:39-42
Application of Image Processing in Welding
WANG Ping;ZHANG Wen-ming
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page:35-38,46
The Implementing of the 3G-TD Mobile Telephone Base Band Processor
ZHOU Xiao-ping;WANG Ping;XU Li-fang;FAN Jing-hui
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page:31-34
Test Technology Research for 16-bit MCU
XUE Hong;WANG Huai-rong
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page:28-30,34
The Design of an Anti-noisy UART Receiver Circuit Used in Serial Communication
ZHOU Jian-hua;XUE Zhong-jie
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page:25-27