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Electronics and Packaging
1681-1070
2008 Issue 11
ASP-based B/S Online Course Selection System Design and Implementation
LV Jun-xia;ZHANG Qian
..............
page:40-42
Discussion Of Compound Semiconductor Photovoltaic Products Development Trend
GUO Feng
..............
page:36-39
Improve the UN of NAND FLASH CELL WL with OPC Methods
XU Hai-jie;CHENG Xiu-lan
..............
page:31-35
The Numerical Frequency Divider Based on FPGA
ZHUANG Hai-jun;LIN Yong-hai
..............
page:28-30
The Research of IP Integration Based on VCI for SOC
ZHENG Sheng-shi;LUO Sheng-qin
..............
page:24-27
Research on Latch-up Effect in CMOS and Its Prevention
LONG En;CHEN Zhu
..............
page:20-23
Technology of Low Power Dissipation for SRAM Designing
FENG Qing;ZHANG Hui-bin;XIA Guang
..............
page:16-19
A New Method of Dynamic Burn-in Test for ICs
ZHU Wei-liang
..............
page:12-15,42
Method of Using Anisotropic Conductive Film for Package Stacking
ZHANG Bin
..............
page:9-11
Aluminum Ribbon Bonding Technology in Power Device Packaging
ZHENG Zhi-qiang;CHENG Xiu-lan;Frank Ta
..............
page:5-8,11
Numerical Thermal Analysis for Low-profile QFP
GAO Guo-hua;YANG Guo-ji;WANG Hong-hui;ZHU Hai-qing
..............
page:1-4